Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
COPPER-CERAMIC BONDED BODY AND POWER MODULE SUBSTRATE
There is a provided a copper-ceramic bonded body in which a copper member (22) formed of copper or a copper alloy and a ceramic member (11) formed of nitride ceramic are bonded to each other, in which an active element oxide layer (30) containing an active element and oxygen is formed at bonding interfaces between the copper member (22) and the ceramic member (11), and a thickness t of the active element oxide layer (30) is in a range of 5 nm to 220 nm.
COPPER-CERAMIC BONDED BODY AND POWER MODULE SUBSTRATE
There is a provided a copper-ceramic bonded body in which a copper member (22) formed of copper or a copper alloy and a ceramic member (11) formed of nitride ceramic are bonded to each other, in which an active element oxide layer (30) containing an active element and oxygen is formed at bonding interfaces between the copper member (22) and the ceramic member (11), and a thickness t of the active element oxide layer (30) is in a range of 5 nm to 220 nm.
COPPER-CERAMIC BONDED BODY AND POWER MODULE SUBSTRATE
KUPFER-KERAMIK VERBUNDKÖRPER UND LEISTUNGSMODULSUBSTRAT
CORPS JOINT CUIVRE-CÉRAMIQUE ET SUBSTRAT DE MODULE DE PUISSANCE
TERASAKI NOBUYUKI (Autor:in) / NAGATOMO YOSHIYUKI (Autor:in)
24.04.2019
Patent
Elektronische Ressource
Englisch
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