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POROUS PLATE-SHAPED FILLER, METHOD FOR PRODUCING SAME, AND HEAT INSULATION FILM
There are disclosed porous plate-shaped fillers which are easy to be laminated, a method for producing the porous plate-shaped filler, and a heat insulation film in which a heat insulation effect improves. A porous plate-shaped filler 1 of the present invention is a plate shape having an aspect ratio of 3 or more, a surface shape is one of a round shape, an oval and a round-comer polygonal shape, and its minimum length is from 0.1 to 50 µm. Furthermore, a sectional shape is one of an arch shape, an elliptic shape, and a quadrangular shape in which at least a part of corners is rounded. Consequently, it is possible to obtain the heat insulation film in which the porous plate-shaped fillers 1 are easy to be laminated and the heat insulation effect improves.
POROUS PLATE-SHAPED FILLER, METHOD FOR PRODUCING SAME, AND HEAT INSULATION FILM
There are disclosed porous plate-shaped fillers which are easy to be laminated, a method for producing the porous plate-shaped filler, and a heat insulation film in which a heat insulation effect improves. A porous plate-shaped filler 1 of the present invention is a plate shape having an aspect ratio of 3 or more, a surface shape is one of a round shape, an oval and a round-comer polygonal shape, and its minimum length is from 0.1 to 50 µm. Furthermore, a sectional shape is one of an arch shape, an elliptic shape, and a quadrangular shape in which at least a part of corners is rounded. Consequently, it is possible to obtain the heat insulation film in which the porous plate-shaped fillers 1 are easy to be laminated and the heat insulation effect improves.
POROUS PLATE-SHAPED FILLER, METHOD FOR PRODUCING SAME, AND HEAT INSULATION FILM
PORÖSER PLATTENFÖRMIGER FÜLLSTOFF, VERFAHREN ZUR HERSTELLUNG DAVON UND WÄRMEDÄMMFOLIE
CHARGE EN FORME DE PLAQUE POREUSE, SON PROCÉDÉ DE FABRICATION ET FILM D'ISOLATION THERMIQUE
ORIBE AKINOBU (Autor:in) / TOMITA TAKAHIRO (Autor:in) / KOBAYASHI HIROHARU (Autor:in)
04.12.2019
Patent
Elektronische Ressource
Englisch
IPC:
C04B
Kalk
,
LIME
/
B23K
Löten
,
SOLDERING OR UNSOLDERING
/
B26D
Schneiden
,
CUTTING
/
C01G
Verbindungen der von den Unterklassen C01D oder C01F nicht umfassten Metalle
,
COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
/
C08K
Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe
,
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
/
C09D
Überzugsmittel, z.B. Anstrichstoffe, Firnisse oder Lacke
,
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS
/
F16L
PIPES
,
Rohre
Europäisches Patentamt | 2019
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