Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
METHOD FOR PRODUCING CERAMIC-ALUMINUM BONDED BODY, METHOD FOR PRODUCING POWER MODULE SUBSTRATE, CERAMIC-ALUMINUM BONDED BODY, AND POWER MODULE SUBSTRATE
A method for producing a ceramic-aluminum bonded body obtained by bonding a ceramic member and an aluminum member, the aluminum member before bonding being composed of aluminum having a purity of 99.0 mass% or higher and 99.9 mass% or lower, includes a heat treatment step of subjecting the aluminum member to a heat treatment in a range of 400°C or higher and lower than a solidus temperature, and a bonding step of bonding the aluminum member after the heat treatment step and the ceramic member via a brazing filler material including Si.
METHOD FOR PRODUCING CERAMIC-ALUMINUM BONDED BODY, METHOD FOR PRODUCING POWER MODULE SUBSTRATE, CERAMIC-ALUMINUM BONDED BODY, AND POWER MODULE SUBSTRATE
A method for producing a ceramic-aluminum bonded body obtained by bonding a ceramic member and an aluminum member, the aluminum member before bonding being composed of aluminum having a purity of 99.0 mass% or higher and 99.9 mass% or lower, includes a heat treatment step of subjecting the aluminum member to a heat treatment in a range of 400°C or higher and lower than a solidus temperature, and a bonding step of bonding the aluminum member after the heat treatment step and the ceramic member via a brazing filler material including Si.
METHOD FOR PRODUCING CERAMIC-ALUMINUM BONDED BODY, METHOD FOR PRODUCING POWER MODULE SUBSTRATE, CERAMIC-ALUMINUM BONDED BODY, AND POWER MODULE SUBSTRATE
VERFAHREN ZUR HERSTELLUNG EINES KERAMIKALUMINUMVERBUNDKÖRPERS, VERFAHREN ZUR HERSTELLUNG EINES LEISTUNGSMODULSUBSTRATS, KERAMIKALUMINUMVERBUNDKÖRPER UND SUBSTRAT FÜR LEISTUNGSMODUL
PROCÉDÉ DE PRODUCTION DE CORPS COLLÉ EN CÉRAMIQUE-ALUMINIUM, PROCÉDÉ DE PRODUCTION DE SUBSTRAT DE MODULE DE PUISSANCE, CORPS COLLÉ EN CÉRAMIQUE-ALUMINIUM ET SUBSTRAT DE MODULE DE PUISSANCE
IWAZAKI WATARU (Autor:in) / ISHIDUKA HIROYA (Autor:in)
24.02.2021
Patent
Elektronische Ressource
Englisch
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