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SUBSTRATES FOR POLYCRYSTALLINE DIAMOND CUTTERS WITH UNIQUE PROPERTIES
A compact, a superabrasive compact and a method of making the compact and superabrasive compact are disclosed. A compact may include a plurality of carbide particles, a binder, and a species. The binder may be dispersed among the plurality of tungsten carbide particles. The species may be dispersed in the compact, wherein the binder has a melting point from about 600° C. to about 1350° C. at ambient pressure. A superabrasive compact may include a diamond table and a substrate. The diamond table may be attached to the substrate. The substrate may have a binder. The melting point of the binder is from about 600° C. to about 1350° C. at high pressure from about 30 kbar to about 100 kbar.
SUBSTRATES FOR POLYCRYSTALLINE DIAMOND CUTTERS WITH UNIQUE PROPERTIES
A compact, a superabrasive compact and a method of making the compact and superabrasive compact are disclosed. A compact may include a plurality of carbide particles, a binder, and a species. The binder may be dispersed among the plurality of tungsten carbide particles. The species may be dispersed in the compact, wherein the binder has a melting point from about 600° C. to about 1350° C. at ambient pressure. A superabrasive compact may include a diamond table and a substrate. The diamond table may be attached to the substrate. The substrate may have a binder. The melting point of the binder is from about 600° C. to about 1350° C. at high pressure from about 30 kbar to about 100 kbar.
SUBSTRATES FOR POLYCRYSTALLINE DIAMOND CUTTERS WITH UNIQUE PROPERTIES
SUBSTRATE FÜR POLYKRISTALLINE DIAMANTSCHNEIDER MIT EINZIGARTIGEN EIGENSCHAFTEN
SUBSTRATS POUR DISPOSITIFS DE COUPE EN DIAMANT POLYCRISTALLIN AYANT DES PROPRIÉTÉS UNIQUES
ZHANG KAI (Autor:in) / SURYAVANSHI ABHIJIT (Autor:in) / HIRSCH ALEXANDER (Autor:in) / ZHANG HUI (Autor:in)
02.08.2017
Patent
Elektronische Ressource
Englisch
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