Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
METHOD FOR REPAIRING AN EQUIPMENT PIECE USED IN SEMICONDUCTOR PROCESSING
A method for the repair of a heater, or an electrostatic chuck, using a ceramic top layer joined with a hermetically sealed joint. The heater or electrostatic chuck may be machined down to remove a damaged top surface, and to allow for the joining of a new top surface. The new top pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.
METHOD FOR REPAIRING AN EQUIPMENT PIECE USED IN SEMICONDUCTOR PROCESSING
A method for the repair of a heater, or an electrostatic chuck, using a ceramic top layer joined with a hermetically sealed joint. The heater or electrostatic chuck may be machined down to remove a damaged top surface, and to allow for the joining of a new top surface. The new top pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.
METHOD FOR REPAIRING AN EQUIPMENT PIECE USED IN SEMICONDUCTOR PROCESSING
VERFAHREN ZUR REPARATUR EINES IN DER HALBLEITERVERARBEITUNG VERWENDETEN AUSSTATTUNGSTEILS
PROCÉDÉ DE RÉPARATION D'UNE PIÈCE D'ÉQUIPEMENT UTILISÉE DANS LE TRAITEMENT DE SEMI-CONDUCTEURS
ELLIOT BRENT D A (Autor:in) / BALMA FRANK (Autor:in) / PARKER MICHAEL (Autor:in) / CUNHA JEFF (Autor:in) / VEYTSER ALEXANDER (Autor:in)
15.04.2020
Patent
Elektronische Ressource
Englisch
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