Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
METHOD FOR PRODUCING METAL/CERAMIC CIRCUIT BOARD
After a copper plate 14 is bonded to at least one surface of a ceramic substrate 10 via an active metal containing brazing filler metal 12 which contains silver, the unnecessary portion of the copper plate 14 and active metal containing brazing filler metal 12 is removed, and thereafter, an unnecessary portion of the copper plate 14 is removed by chemical polishing so as to cause the active metal containing brazing filler metal 12 to protrude from the side face portion of the copper plate 14, and then, a silver layer 18 adhered to the surface of the copper plate 14 by the chemical polishing is removed.
METHOD FOR PRODUCING METAL/CERAMIC CIRCUIT BOARD
After a copper plate 14 is bonded to at least one surface of a ceramic substrate 10 via an active metal containing brazing filler metal 12 which contains silver, the unnecessary portion of the copper plate 14 and active metal containing brazing filler metal 12 is removed, and thereafter, an unnecessary portion of the copper plate 14 is removed by chemical polishing so as to cause the active metal containing brazing filler metal 12 to protrude from the side face portion of the copper plate 14, and then, a silver layer 18 adhered to the surface of the copper plate 14 by the chemical polishing is removed.
METHOD FOR PRODUCING METAL/CERAMIC CIRCUIT BOARD
VERFAHREN ZUR HERSTELLUNG EINER METALL/KERAMIK-LEITERPLATTE
PROCÉDÉ DE PRODUCTION DE CARTE DE CIRCUIT CÉRAMIQUE/MÉTAL
IDENO TAKASHI (Autor:in) / OZAKI AYUMU (Autor:in) / KOBAYASHI KOJI (Autor:in)
08.04.2020
Patent
Elektronische Ressource
Englisch
Metal/ceramic circuit board and method for producing same
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| Europäisches Patentamt | 2021
| Europäisches Patentamt | 2021