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DEVICE FOR CUTTING STRUCTURE AND METHOD FOR CUTTING STRUCTURE
Provided is a cutting device (20) capable of efficiently cutting a cutting object (T) with a simple configuration. The cutting device (20) includes a grasp unit (40) including a first grasper (50a) and a second grasper (50b) movable in an opening and closing directions to grasp the cutting object (T), a cutting unit (60) disposed side by side with the first and second graspers (50a, 50b) and moved in a cutting direction along the opening and closing directions to cut the cutting object (T), and a position setting means (70a, 70b) setting a cutting start position and a cutting end position based on respective positions of the first and second graspers (50a, 50b) that are grasping the cutting object (T), respectively.
DEVICE FOR CUTTING STRUCTURE AND METHOD FOR CUTTING STRUCTURE
Provided is a cutting device (20) capable of efficiently cutting a cutting object (T) with a simple configuration. The cutting device (20) includes a grasp unit (40) including a first grasper (50a) and a second grasper (50b) movable in an opening and closing directions to grasp the cutting object (T), a cutting unit (60) disposed side by side with the first and second graspers (50a, 50b) and moved in a cutting direction along the opening and closing directions to cut the cutting object (T), and a position setting means (70a, 70b) setting a cutting start position and a cutting end position based on respective positions of the first and second graspers (50a, 50b) that are grasping the cutting object (T), respectively.
DEVICE FOR CUTTING STRUCTURE AND METHOD FOR CUTTING STRUCTURE
VORRICHTUNG ZUM SCHNEIDEN EINER STRUKTUR UND VERFAHREN ZUM SCHNEIDEN EINER STRUKTUR
DISPOSITIF POUR STRUCTURE DE COUPE ET PROCÉDÉ POUR STRUCTURE DE COUPE
HOSAKA YOSHINOBU (Autor:in) / MURAOKA DAISUKE (Autor:in) / YAMASAKI TAKANORI (Autor:in)
25.10.2023
Patent
Elektronische Ressource
Englisch
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