Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
METHOD FOR PRODUCING INSULATED CIRCUIT BOARD WITH HEAT SINK
A method is provided for producing an insulating circuit substrate with a heat sink including an insulating circuit substrate and a heat sink, the insulating circuit substrate including a circuit layer and a metal layer that are formed on an insulating layer, and the heat sink being bonded to the metal layer side. The method includes: an aluminum bonding layer forming step of forming an aluminum bonding layer formed of aluminum or an aluminum alloy having a solidus temperature of 650°C or lower on the metal layer; and a heat sink bonding step of laminating a copper bonding material formed of copper or a copper alloy between the aluminum bonding layer and the heat sink and bonding the aluminum bonding layer, the copper bonding material, and the heat sink to each other by solid phase diffusion bonding.
METHOD FOR PRODUCING INSULATED CIRCUIT BOARD WITH HEAT SINK
A method is provided for producing an insulating circuit substrate with a heat sink including an insulating circuit substrate and a heat sink, the insulating circuit substrate including a circuit layer and a metal layer that are formed on an insulating layer, and the heat sink being bonded to the metal layer side. The method includes: an aluminum bonding layer forming step of forming an aluminum bonding layer formed of aluminum or an aluminum alloy having a solidus temperature of 650°C or lower on the metal layer; and a heat sink bonding step of laminating a copper bonding material formed of copper or a copper alloy between the aluminum bonding layer and the heat sink and bonding the aluminum bonding layer, the copper bonding material, and the heat sink to each other by solid phase diffusion bonding.
METHOD FOR PRODUCING INSULATED CIRCUIT BOARD WITH HEAT SINK
VERFAHREN ZUR HERSTELLUNG EINER ISOLIERTEN LEITERPLATTE MIT KÜHLKÖRPER
PROCÉDÉ DE PRODUCTION D'UNE CARTE DE CIRCUIT IMPRIMÉ ISOLÉE POURVUE D'UN DISSIPATEUR THERMIQUE
YUMOTO RYOUHEI (Autor:in) / OOHIRAKI TOMOYA (Autor:in) / KITAHARA TAKESHI (Autor:in) / NAGATOMO YOSHIYUKI (Autor:in)
13.09.2023
Patent
Elektronische Ressource
Englisch
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