Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
HEAT-CONDUCTING MEMBER AND HEAT-DISSIPATING STRUCTURE INCLUDING SAID HEAT-CONDUCTING MEMBER
The present invention is to provide a higher reliable thermal conductive member having higher heat dissipation and smaller anisotropy of thermal conductivity. A thermal conductive member, comprising: first surface layer comprising an insulating material A; a second surface layer comprising an insulating material A; and an intermediate layer comprising an insulating material B and disposed between the first surface layer and the second surface layer, wherein the insulating material A comprises a first boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.6 to 1.4, and a first heat curable resin composition impregnating in the first boron nitride sintered body, and wherein the insulating material B comprises a second boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.01 to 0.05, and a second heat curable resin composition impregnating in the second boron nitride sintered body, provided that the orientation degree means IOP (the Index of Orientation Preference), and calculated by the following equation: IOP = (I100 / I002)par. / (I100/ 002)perp., wherein, (I100 / I002)par.is an intensity ratio of the planes measured along a direction parallel to a thickness direction of the boron nitride sintered body, and (I100 / I002)perp.is an intensity ratio of the planes measured along a direction perpendicular to the thickness direction of the boron nitride sintered body, I100 indicates an intensity of a X-ray diffraction from the (100) plane, and I002 indicates an intensity of a X-ray diffraction from the (002) plane.
HEAT-CONDUCTING MEMBER AND HEAT-DISSIPATING STRUCTURE INCLUDING SAID HEAT-CONDUCTING MEMBER
The present invention is to provide a higher reliable thermal conductive member having higher heat dissipation and smaller anisotropy of thermal conductivity. A thermal conductive member, comprising: first surface layer comprising an insulating material A; a second surface layer comprising an insulating material A; and an intermediate layer comprising an insulating material B and disposed between the first surface layer and the second surface layer, wherein the insulating material A comprises a first boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.6 to 1.4, and a first heat curable resin composition impregnating in the first boron nitride sintered body, and wherein the insulating material B comprises a second boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.01 to 0.05, and a second heat curable resin composition impregnating in the second boron nitride sintered body, provided that the orientation degree means IOP (the Index of Orientation Preference), and calculated by the following equation: IOP = (I100 / I002)par. / (I100/ 002)perp., wherein, (I100 / I002)par.is an intensity ratio of the planes measured along a direction parallel to a thickness direction of the boron nitride sintered body, and (I100 / I002)perp.is an intensity ratio of the planes measured along a direction perpendicular to the thickness direction of the boron nitride sintered body, I100 indicates an intensity of a X-ray diffraction from the (100) plane, and I002 indicates an intensity of a X-ray diffraction from the (002) plane.
HEAT-CONDUCTING MEMBER AND HEAT-DISSIPATING STRUCTURE INCLUDING SAID HEAT-CONDUCTING MEMBER
WÄRMELEITENDES ELEMENT UND WÄRMEABLEITENDE STRUKTUR, EINSCHLIESSLICH DES WÄRMELEITENDEN ELEMENTS
ÉLÉMENT THERMOCONDUCTEUR ET STRUCTURE DE DISSIPATION DE CHALEUR COMPRENANT LEDIT ÉLÉMENT THERMOCONDUCTEUR
INOUE SAORI (Autor:in) / YAMAGATA TOSHITAKA (Autor:in) / MINAKATA YOSHITAKA (Autor:in) / YOSHIMATSU RYO (Autor:in) / KOGA RYUJI (Autor:in)
12.01.2022
Patent
Elektronische Ressource
Englisch
IPC:
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
C04B
Kalk
,
LIME
/
C08K
Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe
,
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
/
C08L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
,
Massen auf Basis makromolekularer Verbindungen
/
H05K
PRINTED CIRCUITS
,
Gedruckte Schaltungen
HEAT-CONDUCTING MEMBER AND HEAT-DISSIPATING STRUCTURE INCLUDING SAID HEAT-CONDUCTING MEMBER
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