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HEAT SHIELD COMPONENT AND MANUFACTURING METHOD THEREOF
A heat shield component (100) includes a substrate (10), and a ceramic porous layer (20) arranged on the substrate (10), the ceramic porous layer (20) including a base body (21) including ceramic, and pores (26) included in the base body (21). Inner walls of the pores (26) are covered with thermoplastic resin (28), and a porosity of the ceramic porous layer (20) is in a range of 40% to 70%. The heat shield component (100) can achieve high heat-insulating properties.
HEAT SHIELD COMPONENT AND MANUFACTURING METHOD THEREOF
A heat shield component (100) includes a substrate (10), and a ceramic porous layer (20) arranged on the substrate (10), the ceramic porous layer (20) including a base body (21) including ceramic, and pores (26) included in the base body (21). Inner walls of the pores (26) are covered with thermoplastic resin (28), and a porosity of the ceramic porous layer (20) is in a range of 40% to 70%. The heat shield component (100) can achieve high heat-insulating properties.
HEAT SHIELD COMPONENT AND MANUFACTURING METHOD THEREOF
HITZESCHILDKOMPONENTE UND VERFAHREN ZU IHRER HERSTELLUNG
COMPOSANT D'ÉCRAN THERMIQUE ET SON PROCÉDÉ DE FABRICATION
SUZUKI YUKA (Autor:in) / MABUCHI YUTAKA (Autor:in)
19.05.2021
Patent
Elektronische Ressource
Englisch
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