Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
COPPER/CERAMIC BONDED BODY, INSULATION CIRCUIT BOARD, METHOD FOR PRODUCING COPPER/CERAMIC BONDED BODY, AND METHOD FOR MANUFACTURING INSULATION CIRCUIT BOARD
A copper/ceramic bonded body includes: a copper member (22) made of copper or a copper alloy; and a ceramic member (11) made of a silicon nitride, wherein the copper member (22) and the ceramic member (11) are bonded to each other, a magnesium oxide layer (31) is provided on a ceramic member (11) side of a bonded interface between the copper member (22) and the ceramic member (11), a Mg solid solution layer (32) is provided between the magnesium oxide layer (31) and the copper member (22) and contains Mg in a state of a solid solution in a Cu primary phase, and a magnesium nitride phase (35) is present on a magnesium oxide layer (31) side of the Mg solid solution layer (32).
COPPER/CERAMIC BONDED BODY, INSULATION CIRCUIT BOARD, METHOD FOR PRODUCING COPPER/CERAMIC BONDED BODY, AND METHOD FOR MANUFACTURING INSULATION CIRCUIT BOARD
A copper/ceramic bonded body includes: a copper member (22) made of copper or a copper alloy; and a ceramic member (11) made of a silicon nitride, wherein the copper member (22) and the ceramic member (11) are bonded to each other, a magnesium oxide layer (31) is provided on a ceramic member (11) side of a bonded interface between the copper member (22) and the ceramic member (11), a Mg solid solution layer (32) is provided between the magnesium oxide layer (31) and the copper member (22) and contains Mg in a state of a solid solution in a Cu primary phase, and a magnesium nitride phase (35) is present on a magnesium oxide layer (31) side of the Mg solid solution layer (32).
COPPER/CERAMIC BONDED BODY, INSULATION CIRCUIT BOARD, METHOD FOR PRODUCING COPPER/CERAMIC BONDED BODY, AND METHOD FOR MANUFACTURING INSULATION CIRCUIT BOARD
KUPFER/KERAMIK-VERBUNDKÖRPER, ISOLIERUNGSLEITERPLATTE, VERFAHREN ZUR HERSTELLUNG DES KUPFER/KERAMIK-VERBUNDKÖRPERS UND VERFAHREN ZUR HERSTELLUNG EINER ISOLIERUNGSLEITERPLATTE
CORPS ASSEMBLÉ EN CUIVRE/CÉRAMIQUE, CARTE DE CIRCUIT IMPRIMÉ ISOLÉE, PROCÉDÉ DE PRODUCTION DE CORPS ASSEMBLÉ EN CUIVRE/CÉRAMIQUE, ET PROCÉDÉ DE FABRICATION DE CARTE DE CIRCUIT IMPRIMÉ ISOLÉE
TERASAKI NOBUYUKI (Autor:in)
27.04.2022
Patent
Elektronische Ressource
Englisch
IPC:
C04B
Kalk
,
LIME
/
B23K
Löten
,
SOLDERING OR UNSOLDERING
/
B33Y
ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
,
Additive (generative) Fertigung, d. h. die Herstellung von dreidimensionalen [3D] Bauteilen durch additive Abscheidung, additive Agglomeration oder additive Schichtung, z. B. durch 3D- Drucken, Stereolithografie oder selektives Lasersintern
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
/
H05K
PRINTED CIRCUITS
,
Gedruckte Schaltungen
| Europäisches Patentamt | 2020
| Europäisches Patentamt | 2020
| Europäisches Patentamt | 2020
| Europäisches Patentamt | 2020
COPPER-CERAMIC BONDED BODY AND INSULATION CIRCUIT BOARD
| Europäisches Patentamt | 2018