Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
ELECTRONIC DEVICE HOUSING, ELECTRONIC DEVICE, AND COMBINED BODY
An electronic device housing, an electronic device and a compound body are provided. The electronic device housing comprises a frame; a sealing layer, disposed on at least a part of an outer surface of the frame, and including a plurality of sub-sealing layers laminated in sequence; and a back case, attached to the frame by the sealing layer, wherein two adjacent sub-sealing layers have different compositions.
ELECTRONIC DEVICE HOUSING, ELECTRONIC DEVICE, AND COMBINED BODY
An electronic device housing, an electronic device and a compound body are provided. The electronic device housing comprises a frame; a sealing layer, disposed on at least a part of an outer surface of the frame, and including a plurality of sub-sealing layers laminated in sequence; and a back case, attached to the frame by the sealing layer, wherein two adjacent sub-sealing layers have different compositions.
ELECTRONIC DEVICE HOUSING, ELECTRONIC DEVICE, AND COMBINED BODY
GEHÄUSE FÜR ELEKTRONISCHE VORRICHTUNG, ELEKTRONISCHE VORRICHTUNG UND KOMBINIERTER KÖRPER
BOÎTIER DE DISPOSITIF ÉLECTRONIQUE, DISPOSITIF ÉLECTRONIQUE ET CORPS COMBINÉ
MA LAN (Autor:in) / JIN HAIYAN (Autor:in) / PAN LING (Autor:in) / YU NA (Autor:in) / CHEN LIANG (Autor:in)
01.12.2021
Patent
Elektronische Ressource
Englisch
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