Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
WALL SURFACE SANDING PATH PLANNING METHOD AND APPARATUS, AND DEVICE AND MEDIUM
Embodiments of the present disclosure disclose a method and device for planning a wall surface polishing path, an apparatus and medium. The method includes: obtaining protruding points of a wall surface to be polished, and dividing the wall surface to be polished into at least two regions; determining a candidate protruding point in the next region of the region where a current protruding point is located; comparing, if the region where the current protruding point is located includes an untraversed protruding point, a first distance between the untraversed protruding point and the current protruding point, with a second distance between the candidate protruding point and the current protruding point; determining the protruding point corresponding to a minimum distance in the first distance and the second distance as a next operation point of the current protruding point; and determining the wall surface polishing path based on the current protruding point and the next operation point of the current protruding point. The technical solution in the embodiments of the present disclosure solves the problem that a polishing path of a current polishing device covers a region with no need for polishing, and achieves effects of optimizing an operation path of a polishing device, improving polishing efficiency, and reducing polishing costs.
WALL SURFACE SANDING PATH PLANNING METHOD AND APPARATUS, AND DEVICE AND MEDIUM
Embodiments of the present disclosure disclose a method and device for planning a wall surface polishing path, an apparatus and medium. The method includes: obtaining protruding points of a wall surface to be polished, and dividing the wall surface to be polished into at least two regions; determining a candidate protruding point in the next region of the region where a current protruding point is located; comparing, if the region where the current protruding point is located includes an untraversed protruding point, a first distance between the untraversed protruding point and the current protruding point, with a second distance between the candidate protruding point and the current protruding point; determining the protruding point corresponding to a minimum distance in the first distance and the second distance as a next operation point of the current protruding point; and determining the wall surface polishing path based on the current protruding point and the next operation point of the current protruding point. The technical solution in the embodiments of the present disclosure solves the problem that a polishing path of a current polishing device covers a region with no need for polishing, and achieves effects of optimizing an operation path of a polishing device, improving polishing efficiency, and reducing polishing costs.
WALL SURFACE SANDING PATH PLANNING METHOD AND APPARATUS, AND DEVICE AND MEDIUM
VERFAHREN UND VORRICHTUNG ZUR PLANUNGSFLÄCHENPOLITUR, VORRICHTUNG UND MEDIUM
PROCÉDÉ ET APPAREIL DE PLANIFICATION DE CHEMIN DE PONÇAGE D'UNE SURFACE DE PAROI, DISPOSITIF ET SUPPORT
YUAN HAONAN (Autor:in) / CHEN HANGYING (Autor:in) / CAO GUO (Autor:in) / SHU YUAN (Autor:in) / LIU MOULIN (Autor:in) / HE SUYUN (Autor:in) / ZHANG TONGXIN (Autor:in) / TAO ZHICHENG (Autor:in)
18.05.2022
Patent
Elektronische Ressource
Englisch
IPC:
B24B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
,
Maschinen, Einrichtungen oder Verfahren zum Schleifen oder Polieren
/
B25J
Manipulatoren
,
MANIPULATORS
/
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
,
Ausbau von Bauwerken, z.B. Treppen, Fußböden
/
G05B
Steuer- oder Regelsysteme allgemein
,
CONTROL OR REGULATING SYSTEMS IN GENERAL
WALL SURFACE SANDING PATH PLANNING METHOD AND APPARATUS, AND DEVICE AND MEDIUM
| Europäisches Patentamt | 2021
Surface Prep: Why Sanding Isn't Enough
| British Library Online Contents | 2001