Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
CERAMIC SUBSTRATE, COMPOSITE SUBSTRATE, CIRCUIT BOARD, METHOD FOR PRODUCING CERAMIC SUBSTRATE, METHOD FOR PRODUCING COMPOSITE SUBSTRATE, METHOD FOR PRODUCING CIRCUIT BOARD, AND METHOD FOR PRODUCING PLURALITY OF CIRCUIT BOARDS
A ceramic substrate of the present invention is a ceramic substrate having a rectangular shape in a plan view, in which, in a case where an intersection formed by a pair of diagonal lines of the ceramic substrate is regarded as a reference in a sheet thickness direction of the ceramic substrate, out of four regions divided by the pair of diagonal lines, one pair of a pair of first regions facing each other across the intersection and a pair of second regions facing each other across the intersection is located on one side in the sheet thickness direction with respect to the intersection, the other pair is located on the other side in the sheet thickness direction with respect to the intersection, and a value obtained by dividing a maximum projection amount in the sheet thickness direction of the ceramic substrate by a length of the diagonal line of the ceramic substrate is equal to or less than 6 µm/mm.
CERAMIC SUBSTRATE, COMPOSITE SUBSTRATE, CIRCUIT BOARD, METHOD FOR PRODUCING CERAMIC SUBSTRATE, METHOD FOR PRODUCING COMPOSITE SUBSTRATE, METHOD FOR PRODUCING CIRCUIT BOARD, AND METHOD FOR PRODUCING PLURALITY OF CIRCUIT BOARDS
A ceramic substrate of the present invention is a ceramic substrate having a rectangular shape in a plan view, in which, in a case where an intersection formed by a pair of diagonal lines of the ceramic substrate is regarded as a reference in a sheet thickness direction of the ceramic substrate, out of four regions divided by the pair of diagonal lines, one pair of a pair of first regions facing each other across the intersection and a pair of second regions facing each other across the intersection is located on one side in the sheet thickness direction with respect to the intersection, the other pair is located on the other side in the sheet thickness direction with respect to the intersection, and a value obtained by dividing a maximum projection amount in the sheet thickness direction of the ceramic substrate by a length of the diagonal line of the ceramic substrate is equal to or less than 6 µm/mm.
CERAMIC SUBSTRATE, COMPOSITE SUBSTRATE, CIRCUIT BOARD, METHOD FOR PRODUCING CERAMIC SUBSTRATE, METHOD FOR PRODUCING COMPOSITE SUBSTRATE, METHOD FOR PRODUCING CIRCUIT BOARD, AND METHOD FOR PRODUCING PLURALITY OF CIRCUIT BOARDS
KERAMIKSUBSTRAT, VERBUNDSUBSTRAT, LEITERPLATTE, VERFAHREN ZUR HERSTELLUNG EINES KERAMISCHEN SUBSTRATS, VERFAHREN ZUR HERSTELLUNG EINES VERBUNDSUBSTRATS, VERFAHREN ZUR HERSTELLUNG EINER LEITERPLATTE UND VERFAHREN ZUR HERSTELLUNG VON MEHREREN LEITERPLATTEN
SUBSTRAT CÉRAMIQUE, SUBSTRAT COMPOSITE, CARTE DE CIRCUIT IMPRIMÉ, PROCÉDÉ DE PRODUCTION DE SUBSTRAT CÉRAMIQUE, PROCÉDÉ DE PRODUCTION DE SUBSTRAT COMPOSITE, PROCÉDÉ DE PRODUCTION DE CARTE DE CIRCUIT IMPRIMÉ, ET PROCÉDÉ POUR LA PRODUCTION D'UNE PLURALITÉ DE CARTES DE CIRCUIT IMPRIMÉ
TSUGAWA YUTA (Autor:in) / NISHIMURA KOJI (Autor:in) / KOBASHI SEIJI (Autor:in) / ESHIMA YOSHIYUKI (Autor:in) / YUASA AKIMASA (Autor:in)
10.04.2024
Patent
Elektronische Ressource
Englisch
CERAMIC CIRCUIT SUBSTRATE AND METHOD FOR PRODUCING CERAMIC CIRCUIT SUBSTRATE
| Europäisches Patentamt | 2019