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    BACKFILL MATERIAL FOR EARTHING APPLICATIONS

    Neue Suche nach: SHUKLA ARUNIMA
    Neue Suche nach: ALMADI VIKAS
    Neue Suche nach: JAISWAL DEVESH

    A conductive and swellable backfill material for earthing applications comprises a conductive material selected from the group of graphite, coke powder and a combination thereof, a polyacrylamide powder, a binder comprising cement, and, optionally, a salt selected from the group of magnesium sulfate, sodium sulfate and a combination thereof. This unique backfill material enables to utilize the same in low moisture zones because of its low resistivity, high-water absorption, and non-leachable behavior.

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    BACKFILL MATERIAL FOR EARTHING APPLICATIONS

    Neue Suche nach: SHUKLA ARUNIMA
    Neue Suche nach: ALMADI VIKAS
    Neue Suche nach: JAISWAL DEVESH

    A conductive and swellable backfill material for earthing applications comprises a conductive material selected from the group of graphite, coke powder and a combination thereof, a polyacrylamide powder, a binder comprising cement, and, optionally, a salt selected from the group of magnesium sulfate, sodium sulfate and a combination thereof. This unique backfill material enables to utilize the same in low moisture zones because of its low resistivity, high-water absorption, and non-leachable behavior.

    Zugriff

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    BACKFILL MATERIAL FOR EARTHING APPLICATIONS

    Neue Suche nach: SHUKLA ARUNIMA
    Neue Suche nach: ALMADI VIKAS
    Neue Suche nach: JAISWAL DEVESH

    A conductive and swellable backfill material for earthing applications comprises a conductive material selected from the group of graphite, coke powder and a combination thereof, a polyacrylamide powder, a binder comprising cement, and, optionally, a salt selected from the group of magnesium sulfate, sodium sulfate and a combination thereof. This unique backfill material enables to utilize the same in low moisture zones because of its low resistivity, high-water absorption, and non-leachable behavior.

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    Titel:

    BACKFILL MATERIAL FOR EARTHING APPLICATIONS

    Weitere Titelangaben:

    HINTERFÜLLUNGSMATERIAL FÜR ERDUNGSANWENDUNGEN
    MATÉRIAU DE REMBLAYAGE POUR APPLICATIONS DE MISE À LA TERRE

    Beteiligte:

    SHUKLA ARUNIMA (Autor:in) / ALMADI VIKAS (Autor:in) / JAISWAL DEVESH (Autor:in)

    Erscheinungsdatum:

    24.01.2024

    Medientyp:

    Patent

    Format:

    Elektronische Ressource

    Sprache:

    Englisch

    Klassifikation:

    IPC:  C04B Kalk , LIME / C23F Nichtmechanisches Entfernen metallischer Stoffe von Oberflächen , NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES / H01R Elektrisch leitende Verbindungen , ELECTRICALLY-CONDUCTIVE CONNECTIONS

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