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Low firing temperature dielectric materials designed to be co-fired with high bismuth garnet ferrites for miniaturized isolators and circulators
A method of forming a composite material for use as an isolator or circulator in a radiofrequency device comprises providing a low temperature fireable outer material, the low fireable outer material having a garnet or scheelite structure, inserting a high dielectric constant inner material having a dielectric constant above 30 within an aperture in the low temperature fireable outer material, and co-firing the lower temperature fireable outer material and the high dielectric constant inner material together at temperature between 650-900° C. to shrink the low temperature fireable outer material around an outer surface of the high dielectric constant inner material to form an integrated magnetic/dielectric assembly without the use of adhesive or glue.
Low firing temperature dielectric materials designed to be co-fired with high bismuth garnet ferrites for miniaturized isolators and circulators
A method of forming a composite material for use as an isolator or circulator in a radiofrequency device comprises providing a low temperature fireable outer material, the low fireable outer material having a garnet or scheelite structure, inserting a high dielectric constant inner material having a dielectric constant above 30 within an aperture in the low temperature fireable outer material, and co-firing the lower temperature fireable outer material and the high dielectric constant inner material together at temperature between 650-900° C. to shrink the low temperature fireable outer material around an outer surface of the high dielectric constant inner material to form an integrated magnetic/dielectric assembly without the use of adhesive or glue.
Low firing temperature dielectric materials designed to be co-fired with high bismuth garnet ferrites for miniaturized isolators and circulators
MICHAEL DAVID HILL (Autor:in) / DAVID BOWIE CRUICKSHANK (Autor:in) / JEFFREY ALAN SHUNKWILER (Autor:in) / JIANZHONG JIANG (Autor:in) / DAVID MARTIN FIROR (Autor:in) / SRINIVAS POLISETTY (Autor:in)
01.02.2023
Patent
Elektronische Ressource
Englisch
IPC:
H01P
WAVEGUIDES
,
Wellenleiter [Hohlleiter]
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
C01G
Verbindungen der von den Unterklassen C01D oder C01F nicht umfassten Metalle
,
COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
/
C04B
Kalk
,
LIME
/
H01B
CABLES
,
Kabel
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