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    DIAMOND POLYCRYSTAL, CUTTING TOOL, WEAR-RESISTANT TOOL, GRINDING TOOL, AND MANUFACTURING METHOD OF DIAMOND POLYCRYSTAL

    Neue Suche nach: ISHIDA TAKESHI
    Neue Suche nach: ARIMOTO KEIKO
    Neue Suche nach: YAMAMOTO KAZUKO
    Neue Suche nach: SUMIYA HITOSHI

    PROBLEM TO BE SOLVED: To provide a tough diamond polycrystal with small particle size, a cutting tool, a wear-resistant tool, a grinding tool and a manufacturing method of the diamond polycrystal.SOLUTION: A diamond polycrystal 10 contains diamond particles having a mean diameter smaller than 50 nm. In a breaking strength test pushing a diamond presser D with a tip radius Dr of 50 μm to a surface 10s of the diamond polycrystal 10 with loading rate of 100 N/min, crack initiation load is more than 10 N.SELECTED DRAWING: Figure 1

    【課題】小さい粒径で、かつ強靭なダイヤモンド多結晶体、切削工具、耐摩工具、研削工具、およびダイヤモンド多結晶体の製造方法を提供する。【解決手段】ダイヤモンド多結晶体１０は、ダイヤモンド粒子を含み、該ダイヤモンド粒子は、５０ｎｍ以下の平均粒径を有し、ダイヤモンド多結晶体１０の表面１０ｓに先端半径Ｄｒが５０μｍのダイヤモンド圧子Ｄを１００Ｎ／ｍｉｎの負荷速度で押し当てる破壊強度試験において、亀裂発生荷重が１０Ｎ以上である。【選択図】図１

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    DIAMOND POLYCRYSTAL, CUTTING TOOL, WEAR-RESISTANT TOOL, GRINDING TOOL, AND MANUFACTURING METHOD OF DIAMOND POLYCRYSTAL

    Neue Suche nach: ISHIDA TAKESHI
    Neue Suche nach: ARIMOTO KEIKO
    Neue Suche nach: YAMAMOTO KAZUKO
    Neue Suche nach: SUMIYA HITOSHI

    PROBLEM TO BE SOLVED: To provide a tough diamond polycrystal with small particle size, a cutting tool, a wear-resistant tool, a grinding tool and a manufacturing method of the diamond polycrystal.SOLUTION: A diamond polycrystal 10 contains diamond particles having a mean diameter smaller than 50 nm. In a breaking strength test pushing a diamond presser D with a tip radius Dr of 50 μm to a surface 10s of the diamond polycrystal 10 with loading rate of 100 N/min, crack initiation load is more than 10 N.SELECTED DRAWING: Figure 1

    【課題】小さい粒径で、かつ強靭なダイヤモンド多結晶体、切削工具、耐摩工具、研削工具、およびダイヤモンド多結晶体の製造方法を提供する。【解決手段】ダイヤモンド多結晶体１０は、ダイヤモンド粒子を含み、該ダイヤモンド粒子は、５０ｎｍ以下の平均粒径を有し、ダイヤモンド多結晶体１０の表面１０ｓに先端半径Ｄｒが５０μｍのダイヤモンド圧子Ｄを１００Ｎ／ｍｉｎの負荷速度で押し当てる破壊強度試験において、亀裂発生荷重が１０Ｎ以上である。【選択図】図１

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    DIAMOND POLYCRYSTAL, CUTTING TOOL, WEAR-RESISTANT TOOL, GRINDING TOOL, AND MANUFACTURING METHOD OF DIAMOND POLYCRYSTAL

    Neue Suche nach: ISHIDA TAKESHI
    Neue Suche nach: ARIMOTO KEIKO
    Neue Suche nach: YAMAMOTO KAZUKO
    Neue Suche nach: SUMIYA HITOSHI

    PROBLEM TO BE SOLVED: To provide a tough diamond polycrystal with small particle size, a cutting tool, a wear-resistant tool, a grinding tool and a manufacturing method of the diamond polycrystal.SOLUTION: A diamond polycrystal 10 contains diamond particles having a mean diameter smaller than 50 nm. In a breaking strength test pushing a diamond presser D with a tip radius Dr of 50 μm to a surface 10s of the diamond polycrystal 10 with loading rate of 100 N/min, crack initiation load is more than 10 N.SELECTED DRAWING: Figure 1

    【課題】小さい粒径で、かつ強靭なダイヤモンド多結晶体、切削工具、耐摩工具、研削工具、およびダイヤモンド多結晶体の製造方法を提供する。【解決手段】ダイヤモンド多結晶体１０は、ダイヤモンド粒子を含み、該ダイヤモンド粒子は、５０ｎｍ以下の平均粒径を有し、ダイヤモンド多結晶体１０の表面１０ｓに先端半径Ｄｒが５０μｍのダイヤモンド圧子Ｄを１００Ｎ／ｍｉｎの負荷速度で押し当てる破壊強度試験において、亀裂発生荷重が１０Ｎ以上である。【選択図】図１

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    Titel:

    DIAMOND POLYCRYSTAL, CUTTING TOOL, WEAR-RESISTANT TOOL, GRINDING TOOL, AND MANUFACTURING METHOD OF DIAMOND POLYCRYSTAL

    Weitere Titelangaben:

    ダイヤモンド多結晶体、切削工具、耐摩工具、研削工具、およびダイヤモンド多結晶体の製造方法

    Beteiligte:

    ISHIDA TAKESHI (Autor:in) / ARIMOTO KEIKO (Autor:in) / YAMAMOTO KAZUKO (Autor:in) / SUMIYA HITOSHI (Autor:in)

    Erscheinungsdatum:

    08.09.2016

    Medientyp:

    Patent

    Format:

    Elektronische Ressource

    Sprache:

    Japanisch

    Klassifikation:

    IPC:  C04B Kalk , LIME / B23B Drehen , TURNING / B24D TOOLS FOR GRINDING, BUFFING OR SHARPENING , Werkzeuge zum Schleifen, Polieren oder Schärfen / C01B NON-METALLIC ELEMENTS , Nichtmetallische Elemente

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