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To provide a ceramic structure that can prevent cracks from generating in a ceramic base material and a conductive member even if using a long term.SOLUTION: A ceramic structure 1 comprises: a ceramic base material 10 having a principal surface 11, a hole 12 extending from the principal surface 11 to an inside of the ceramic base material 10; a metal electrode layer 20 embedded in the ceramic base material 10; and a conductive member 30 that is electrically connected to the metal electrode layer 20, and is embedded in the ceramic base material 10 so as to configure a bottom 13 of the hole 12. The ceramic structure 1 further comprises: a first metallic member 40 that is bonded to the conductive member 30 by a solder material 21, and has a mean coefficient of linear expansion greater than a mean coefficient of linear expansion of the conductive member 30; one or more second metallic members 50 that have mean coefficients of linear expansion greater than that of the first metallic member 40; and a metallic terminal 60 that is bonded to the second metallic member 50, and has a mean coefficient of linear expansion greater than the second metallic member 50.SELECTED DRAWING: Figure 2
【課題】長期間使用してもセラミックス基材や導電部材にクラックが入ることを防止できるセラミックス構造体を提供すること。【解決手段】セラミックス構造体1は、主面11を有するセラミックス基材10と、主面11からセラミックス基材10の内部に伸長する穴部12と、セラミックス基材10に埋設されている金属電極層20と、金属電極層20に電気的に接続され且つ穴部12の底部13を構成するようにセラミックス基材10に埋設されている導電部材30とを含む。さらにセラミックス構造体は1、導電部材30にロウ材21によって接合され、導電部材30の平均線膨張係数以上の大きさの平均線膨張係数を有する第1の金属部材40と、第1の金属部材40より平均線膨張係数が大きい一又は複数の第2の金属部材50と、第2の金属部材50に接合され、第2の金属部材50より平均線膨張係数が大きい金属端子60とを含む。【選択図】図2
To provide a ceramic structure that can prevent cracks from generating in a ceramic base material and a conductive member even if using a long term.SOLUTION: A ceramic structure 1 comprises: a ceramic base material 10 having a principal surface 11, a hole 12 extending from the principal surface 11 to an inside of the ceramic base material 10; a metal electrode layer 20 embedded in the ceramic base material 10; and a conductive member 30 that is electrically connected to the metal electrode layer 20, and is embedded in the ceramic base material 10 so as to configure a bottom 13 of the hole 12. The ceramic structure 1 further comprises: a first metallic member 40 that is bonded to the conductive member 30 by a solder material 21, and has a mean coefficient of linear expansion greater than a mean coefficient of linear expansion of the conductive member 30; one or more second metallic members 50 that have mean coefficients of linear expansion greater than that of the first metallic member 40; and a metallic terminal 60 that is bonded to the second metallic member 50, and has a mean coefficient of linear expansion greater than the second metallic member 50.SELECTED DRAWING: Figure 2
【課題】長期間使用してもセラミックス基材や導電部材にクラックが入ることを防止できるセラミックス構造体を提供すること。【解決手段】セラミックス構造体1は、主面11を有するセラミックス基材10と、主面11からセラミックス基材10の内部に伸長する穴部12と、セラミックス基材10に埋設されている金属電極層20と、金属電極層20に電気的に接続され且つ穴部12の底部13を構成するようにセラミックス基材10に埋設されている導電部材30とを含む。さらにセラミックス構造体は1、導電部材30にロウ材21によって接合され、導電部材30の平均線膨張係数以上の大きさの平均線膨張係数を有する第1の金属部材40と、第1の金属部材40より平均線膨張係数が大きい一又は複数の第2の金属部材50と、第2の金属部材50に接合され、第2の金属部材50より平均線膨張係数が大きい金属端子60とを含む。【選択図】図2
CERAMIC STRUCTURE
セラミックス構造体
TSUCHIDA ATSUSHI (Autor:in)
24.10.2019
Patent
Elektronische Ressource
Japanisch