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INSULATION STRIP FOR EXPANSION JOINT AND EXPANSION JOINT
To provide an insulation strip capable of being installed in a narrow void of an expansion joint, having an excellent insulation function, having a better followability or displacement absorption function for an expansion displacement and capable of a simple construction.SOLUTION: An insulation material 5 packaged in a thin sheet shape such as a vacuum insulation material is used and this is curved in substantially U shape, its both ends part are connected to a support material in synthetic resin and mounted to skeleton A, B end parts and the insulation material is bridged in the void.SELECTED DRAWING: Figure 1
【課題】エキスパンションジョイントの幅の狭い間隙内に設置することが可能であり、断熱性能に優れ、間隙の伸縮変位に対する追従性や変位吸収性が良好で簡易に施工が可能な断熱帯を提供する。【解決手段】真空断熱材などの薄いシート状でパッケージ化された断熱材5を用い、これを略々U字形に湾曲させ、その両端部分を合成樹脂製の支持材に接続して躯体A,B端部に取り付け、断熱材を間隙内に架設する。【選択図】図1
INSULATION STRIP FOR EXPANSION JOINT AND EXPANSION JOINT
To provide an insulation strip capable of being installed in a narrow void of an expansion joint, having an excellent insulation function, having a better followability or displacement absorption function for an expansion displacement and capable of a simple construction.SOLUTION: An insulation material 5 packaged in a thin sheet shape such as a vacuum insulation material is used and this is curved in substantially U shape, its both ends part are connected to a support material in synthetic resin and mounted to skeleton A, B end parts and the insulation material is bridged in the void.SELECTED DRAWING: Figure 1
【課題】エキスパンションジョイントの幅の狭い間隙内に設置することが可能であり、断熱性能に優れ、間隙の伸縮変位に対する追従性や変位吸収性が良好で簡易に施工が可能な断熱帯を提供する。【解決手段】真空断熱材などの薄いシート状でパッケージ化された断熱材5を用い、これを略々U字形に湾曲させ、その両端部分を合成樹脂製の支持材に接続して躯体A,B端部に取り付け、断熱材を間隙内に架設する。【選択図】図1
INSULATION STRIP FOR EXPANSION JOINT AND EXPANSION JOINT
エキスパンションジョイント用の断熱帯及びエキスパンションジョイント
ASANO TAKUYA (Autor:in)
14.11.2019
Patent
Elektronische Ressource
Japanisch
IPC:
E04B
Allgemeine Baukonstruktionen
,
GENERAL BUILDING CONSTRUCTIONS
Ground stone installation expansion joint metal strip
Europäisches Patentamt | 2021
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