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MOLDING METHOD FOR THREE-DIMENSIONAL STRUCTURE AND MOLDING DEVICE FOR THREE-DIMENSIONAL STRUCTURE
To accurately mold a three-dimensional structure directly at a high speed, using a low-powered laser without using a support member for supporting a shape of the three-dimensional structure, in a molding process of the three-dimensional structure.SOLUTION: A molding method for a three-dimensional structure that molds a three-dimensional structure at least includes: a process of forming a layer of a molding material 707 at least containing a pulverulent body 501 and a resin binder 702; and a process of fixing the pulverulent body 501 by heating the layer at a temperature higher than a glass transition point of the resin binder 702, or by irradiating the resin binder 702 with light.SELECTED DRAWING: Figure 5
【課題】三次元構造物の造形処理に際し、三次元構造物の形状をサポートするためのサポート部材を用いることなく、低出力のレーザを用いて、高速かつ直接的に三次元構造物を精度よく造形する。【解決手段】三次元構造物を造形する三次元構造物の造形方法において、少なくとも粉体501および樹脂バインダー702を含む造形材707の層を形成する工程と、樹脂バインダー702のガラス転移点以上の温度で層を加熱するか、または樹脂バインダー702に光照射することで、粉体501を固定させる工程と、を少なくとも含む。【選択図】図5
MOLDING METHOD FOR THREE-DIMENSIONAL STRUCTURE AND MOLDING DEVICE FOR THREE-DIMENSIONAL STRUCTURE
To accurately mold a three-dimensional structure directly at a high speed, using a low-powered laser without using a support member for supporting a shape of the three-dimensional structure, in a molding process of the three-dimensional structure.SOLUTION: A molding method for a three-dimensional structure that molds a three-dimensional structure at least includes: a process of forming a layer of a molding material 707 at least containing a pulverulent body 501 and a resin binder 702; and a process of fixing the pulverulent body 501 by heating the layer at a temperature higher than a glass transition point of the resin binder 702, or by irradiating the resin binder 702 with light.SELECTED DRAWING: Figure 5
【課題】三次元構造物の造形処理に際し、三次元構造物の形状をサポートするためのサポート部材を用いることなく、低出力のレーザを用いて、高速かつ直接的に三次元構造物を精度よく造形する。【解決手段】三次元構造物を造形する三次元構造物の造形方法において、少なくとも粉体501および樹脂バインダー702を含む造形材707の層を形成する工程と、樹脂バインダー702のガラス転移点以上の温度で層を加熱するか、または樹脂バインダー702に光照射することで、粉体501を固定させる工程と、を少なくとも含む。【選択図】図5
MOLDING METHOD FOR THREE-DIMENSIONAL STRUCTURE AND MOLDING DEVICE FOR THREE-DIMENSIONAL STRUCTURE
三次元構造物の造形方法、三次元構造物の造形装置
CHIN KENHO (Autor:in)
21.05.2020
Patent
Elektronische Ressource
Japanisch
IPC:
B22F
Verarbeiten von Metallpulver
,
WORKING METALLIC POWDER
/
B28B
Formgeben von Ton oder anderen keramischen Stoffzusammensetzungen, Schlacke oder von Mischungen, die zementartiges Material enthalten, z.B. Putzmörtel
,
SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG OR MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
/
B29C
Formen oder Verbinden von Kunststoffen
,
SHAPING OR JOINING OF PLASTICS
/
B33Y
ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
,
Additive (generative) Fertigung, d. h. die Herstellung von dreidimensionalen [3D] Bauteilen durch additive Abscheidung, additive Agglomeration oder additive Schichtung, z. B. durch 3D- Drucken, Stereolithografie oder selektives Lasersintern
/
C04B
Kalk
,
LIME
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