Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
COPPER/CERAMIC-JOINTED STRUCTURE, INSULATED CIRCUIT BOARD, METHOD FOR MANUFACTURING COPPER/CERAMIC-JOINTED STRUCTURE, AND METHOD FOR MANUFACTURING INSULATED CIRCUIT BOARD
To provide a copper/ceramic-jointed structure excellent in ultrasonic bondability, wherein: a ceramic member and a copper member can be prevented from exfoliating even when ultrasonic bonding is performed; and the ceramic member can be prevented from being cracked.SOLUTION: A copper/ceramic-jointed structure 10 is formed by joining a copper member 12 comprising copper or a copper alloy and a ceramic member 11, wherein among the ceramic member 11 and the copper member 12; an active metal compound layer 41 is formed on a surface of the ceramic member 11, the compound layer comprising a compound of one or more active metals selected from Ti, Zr, Nb, and Hf; Cu-Mg intermetallic compound phase 45 is formed on a side of the copper member 12 in the active metal compound layer 41, the compound phase comprising an intermetallic compound that contains Cu and Mg; and an area ratio of the Cu-Mg intermetallic compound phase 45 in a region up to 50 μm from a joint area of the ceramic member 11 toward the side of the copper member 12 is in a range of 20% or more and 45% or less.SELECTED DRAWING: Figure 2
【課題】超音波接合を行った場合であってもセラミックス部材と銅部材との剥離を抑制することができるとともにセラミックス部材の割れの発生を抑制することができ、超音波接合性に優れた銅／セラミックス接合体を提供する。【解決手段】銅又は銅合金からなる銅部材１２と、セラミックス部材１１とが接合されてなる銅／セラミックス接合体１０であって、セラミックス部材１１と銅部材１２との間において、セラミックス部材１１の表面には、Ｔｉ，Ｚｒ，Ｎｂ，Ｈｆから選択される１種又は２種以上の活性金属の化合物を含む活性金属化合物層４１が形成され、この活性金属化合物層４１の銅部材１２側に、ＣｕとＭｇを含む金属間化合物からなるＣｕ−Ｍｇ金属間化合物相４５が形成されており、セラミックス部材１１の接合面から銅部材１２側へ５０μｍまでの領域におけるＣｕ−Ｍｇ金属間化合物相４５の面積率が２０％以上４５％以下の範囲内とされている。【選択図】図２
COPPER/CERAMIC-JOINTED STRUCTURE, INSULATED CIRCUIT BOARD, METHOD FOR MANUFACTURING COPPER/CERAMIC-JOINTED STRUCTURE, AND METHOD FOR MANUFACTURING INSULATED CIRCUIT BOARD
To provide a copper/ceramic-jointed structure excellent in ultrasonic bondability, wherein: a ceramic member and a copper member can be prevented from exfoliating even when ultrasonic bonding is performed; and the ceramic member can be prevented from being cracked.SOLUTION: A copper/ceramic-jointed structure 10 is formed by joining a copper member 12 comprising copper or a copper alloy and a ceramic member 11, wherein among the ceramic member 11 and the copper member 12; an active metal compound layer 41 is formed on a surface of the ceramic member 11, the compound layer comprising a compound of one or more active metals selected from Ti, Zr, Nb, and Hf; Cu-Mg intermetallic compound phase 45 is formed on a side of the copper member 12 in the active metal compound layer 41, the compound phase comprising an intermetallic compound that contains Cu and Mg; and an area ratio of the Cu-Mg intermetallic compound phase 45 in a region up to 50 μm from a joint area of the ceramic member 11 toward the side of the copper member 12 is in a range of 20% or more and 45% or less.SELECTED DRAWING: Figure 2
【課題】超音波接合を行った場合であってもセラミックス部材と銅部材との剥離を抑制することができるとともにセラミックス部材の割れの発生を抑制することができ、超音波接合性に優れた銅／セラミックス接合体を提供する。【解決手段】銅又は銅合金からなる銅部材１２と、セラミックス部材１１とが接合されてなる銅／セラミックス接合体１０であって、セラミックス部材１１と銅部材１２との間において、セラミックス部材１１の表面には、Ｔｉ，Ｚｒ，Ｎｂ，Ｈｆから選択される１種又は２種以上の活性金属の化合物を含む活性金属化合物層４１が形成され、この活性金属化合物層４１の銅部材１２側に、ＣｕとＭｇを含む金属間化合物からなるＣｕ−Ｍｇ金属間化合物相４５が形成されており、セラミックス部材１１の接合面から銅部材１２側へ５０μｍまでの領域におけるＣｕ−Ｍｇ金属間化合物相４５の面積率が２０％以上４５％以下の範囲内とされている。【選択図】図２
COPPER/CERAMIC-JOINTED STRUCTURE, INSULATED CIRCUIT BOARD, METHOD FOR MANUFACTURING COPPER/CERAMIC-JOINTED STRUCTURE, AND METHOD FOR MANUFACTURING INSULATED CIRCUIT BOARD
銅／セラミックス接合体、絶縁回路基板、及び、銅／セラミックス接合体の製造方法、絶縁回路基板の製造方法
TERASAKI NOBUYUKI (Autor:in)
15.02.2021
Patent
Elektronische Ressource
Japanisch
COPPER/CERAMIC JOINTED BODY AND INSULATED CIRCUIT BOARD
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