Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
To provide a holding device capable of securing airtightness even when a bonding layer is formed of an air-permeable metal bonding material.SOLUTION: An electrostatic chuck 1 that holds a semiconductor wafer W on a holding surface 11 of a plate-like member 10, has: the plate-like member 10 that comprises a first through-hole 15; a base member 20 that comprises cooling medium passages 23 in which a cooling medium flows and a second through-hole 25 communicated with the first through-hole 15; and a bonding layer 40 formed with a third through-hole 45 that makes the first through-hole 15 and the second through-hole 25 communicate with each other, and bonding between the plate-like member 10 and the base member 20. The bonding layer 40 is formed of an air-permeable metal bonding material and has a cylindrical member 35 arranged inside the second through-hole 25 and the third through-hole 45 so as to surround an opening of the first through-hole 15. The cylindrical member 35 is arranged between the cooling medium passages 23 of the base member 20 and bonded with the base member 20 with an adhesive agent 36 arranged between an outer peripheral surface and an inner peripheral surface of the second through-hole 35.SELECTED DRAWING: Figure 2
【課題】接合層を通気性のある金属接合材で形成しても、気密性を確保することができる保持装置を提供すること。【解決手段】第１貫通孔１５を備える板状部材１０と、冷媒が流れる冷媒流路２３と、第１貫通孔１５に連通する第２貫通孔２５とを備えるベース部材２０と、第１貫通孔１５と第２貫通孔２５を連通させる第３貫通孔４５が形成され、板状部材１０とベース部材２０とを接合する接合層４０と、を有し、板状部材１０の保持面１１上に半導体ウエハＷを保持する静電チャック１において、接合層４０は、通気性のある金属接合材で形成されており、第１貫通孔１５の開口を囲むように、第２貫通孔２５及び第３貫通孔４５の内側に配置される筒状部材３５を有し、筒状部材３５は、ベース部材２０の冷媒流路２３間に配置され、外周面と第２貫通孔３５の内周面との間に配置された接着剤３６によってベース部材２０に接合されている。【選択図】図２
To provide a holding device capable of securing airtightness even when a bonding layer is formed of an air-permeable metal bonding material.SOLUTION: An electrostatic chuck 1 that holds a semiconductor wafer W on a holding surface 11 of a plate-like member 10, has: the plate-like member 10 that comprises a first through-hole 15; a base member 20 that comprises cooling medium passages 23 in which a cooling medium flows and a second through-hole 25 communicated with the first through-hole 15; and a bonding layer 40 formed with a third through-hole 45 that makes the first through-hole 15 and the second through-hole 25 communicate with each other, and bonding between the plate-like member 10 and the base member 20. The bonding layer 40 is formed of an air-permeable metal bonding material and has a cylindrical member 35 arranged inside the second through-hole 25 and the third through-hole 45 so as to surround an opening of the first through-hole 15. The cylindrical member 35 is arranged between the cooling medium passages 23 of the base member 20 and bonded with the base member 20 with an adhesive agent 36 arranged between an outer peripheral surface and an inner peripheral surface of the second through-hole 35.SELECTED DRAWING: Figure 2
【課題】接合層を通気性のある金属接合材で形成しても、気密性を確保することができる保持装置を提供すること。【解決手段】第１貫通孔１５を備える板状部材１０と、冷媒が流れる冷媒流路２３と、第１貫通孔１５に連通する第２貫通孔２５とを備えるベース部材２０と、第１貫通孔１５と第２貫通孔２５を連通させる第３貫通孔４５が形成され、板状部材１０とベース部材２０とを接合する接合層４０と、を有し、板状部材１０の保持面１１上に半導体ウエハＷを保持する静電チャック１において、接合層４０は、通気性のある金属接合材で形成されており、第１貫通孔１５の開口を囲むように、第２貫通孔２５及び第３貫通孔４５の内側に配置される筒状部材３５を有し、筒状部材３５は、ベース部材２０の冷媒流路２３間に配置され、外周面と第２貫通孔３５の内周面との間に配置された接着剤３６によってベース部材２０に接合されている。【選択図】図２
HOLDING DEVICE
保持装置
MIWA KANAME (Autor:in)
06.01.2023
Patent
Elektronische Ressource
Japanisch
HOLDING DEVICE AND ELECTRONIC DEVICE COMPRISING HOLDING DEVICE
| Europäisches Patentamt | 2018