Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
BONDING METHOD OF TILE
To provide a bonding method of tiles allowing central air to be easily extruded to an end part by simply forming a concave groove in a horizontal direction in an adhesive layer.SOLUTION: A bonding method comprises: bonding a plurality of removable tapes 1, 1a parallel to each other in specific intervals so as to reach one edge of two edges facing each other in a bonding area A of a wall substrate W from the other edge so as to form an adhesive layer 3 in which a plurality of grooves 2, 2a are formed in the bonding area A; forming a plurality of air leaking grooves 4, 4a in the adhesive layer 3 by peeling the tapes 1, 1a and removing the adhesive of the section; bonding tiles T on the adhesive layer 3; and pressing the tiles T to the wall substrate W side while the air leaking grooves 4, 4a are left as it is so as to crush the concave grooves 2, 2a to force air in the concave grooves 2, 2a leak into the air leaking grooves 4, 4a, to make no air left in the central part between the tiles T and the adhesive layer 3 which allows creation of bubbles between the tiles T and the adhesive layer 3 to be reduced as much as possible.SELECTED DRAWING: Figure 5
【課題】接着剤層に水平方向の凹溝を形成しただけでは中央部寄りの空気を端部まで押し出し難い。【解決手段】壁下地Ｗの貼付け領域Ａにおける対向する二辺の一方より他方に至る様に複数枚の剥離可能なテープ１、1a…を所定間隔毎に平行に貼り付け、貼付け領域Ａに複数本の凹溝２、2a…が形成された接着剤層３を形成した後、テープ１、1a…を剥がし当該部位の接着剤を除去することで、接着剤層３に複数本の空気逃がし溝４、4a…を形成し、タイルＴを接着剤層３に貼り付けた後、タイルＴを、空気逃がし溝４、4a…を残したまま壁下地Ｗ側へ、凹溝２、2a…を潰す様に押し付けて、該凹溝２、2a…内の空気を空気逃がし溝４、4a…内へも逃がせる様にすることによって、タイルＴと接着剤層３間の中央部位にも空気を残存させず、タイルＴと接着剤層３との間での気泡の発生を可能な限り低減化することが出来る。【選択図】図５
BONDING METHOD OF TILE
To provide a bonding method of tiles allowing central air to be easily extruded to an end part by simply forming a concave groove in a horizontal direction in an adhesive layer.SOLUTION: A bonding method comprises: bonding a plurality of removable tapes 1, 1a parallel to each other in specific intervals so as to reach one edge of two edges facing each other in a bonding area A of a wall substrate W from the other edge so as to form an adhesive layer 3 in which a plurality of grooves 2, 2a are formed in the bonding area A; forming a plurality of air leaking grooves 4, 4a in the adhesive layer 3 by peeling the tapes 1, 1a and removing the adhesive of the section; bonding tiles T on the adhesive layer 3; and pressing the tiles T to the wall substrate W side while the air leaking grooves 4, 4a are left as it is so as to crush the concave grooves 2, 2a to force air in the concave grooves 2, 2a leak into the air leaking grooves 4, 4a, to make no air left in the central part between the tiles T and the adhesive layer 3 which allows creation of bubbles between the tiles T and the adhesive layer 3 to be reduced as much as possible.SELECTED DRAWING: Figure 5
【課題】接着剤層に水平方向の凹溝を形成しただけでは中央部寄りの空気を端部まで押し出し難い。【解決手段】壁下地Ｗの貼付け領域Ａにおける対向する二辺の一方より他方に至る様に複数枚の剥離可能なテープ１、1a…を所定間隔毎に平行に貼り付け、貼付け領域Ａに複数本の凹溝２、2a…が形成された接着剤層３を形成した後、テープ１、1a…を剥がし当該部位の接着剤を除去することで、接着剤層３に複数本の空気逃がし溝４、4a…を形成し、タイルＴを接着剤層３に貼り付けた後、タイルＴを、空気逃がし溝４、4a…を残したまま壁下地Ｗ側へ、凹溝２、2a…を潰す様に押し付けて、該凹溝２、2a…内の空気を空気逃がし溝４、4a…内へも逃がせる様にすることによって、タイルＴと接着剤層３間の中央部位にも空気を残存させず、タイルＴと接着剤層３との間での気泡の発生を可能な限り低減化することが出来る。【選択図】図５
BONDING METHOD OF TILE
タイルの接着方法
NUKAYA KIYOTAKA (Autor:in) / KONDO HISAMI (Autor:in) / TOGAMI HARUKU (Autor:in)
14.03.2023
Patent
Elektronische Ressource
Japanisch
IPC:
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
,
Ausbau von Bauwerken, z.B. Treppen, Fußböden
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