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ACRYLIC RESIN COMPOSITION AND PANEL MATERIAL FOR BUILDING
To form a cured product that does not suffer a significant decrease in elastic modulus even at high temperatures, from an acrylic resin composition that is low in viscosity compared to epoxy resin and the like and can also be cured at low temperatures.SOLUTION: An acrylic resin composition comprises a polymerizable compound comprising at least one monomer mi (1≤i≤N) and a curing agent and gives a cured product with the ratio of a storage modulus at 250°C to that at 25°C being 20% or more.SELECTED DRAWING: Figure 1
【課題】エポキシ樹脂等に比べて低粘度であり、かつ低温で硬化が可能なアクリル樹脂組成物から、高温下でも弾性率が大きく低下しない硬化物を生成させる。【解決手段】1種以上のモノマーmi(1≦i≦N)を含む重合性化合物と、硬化剤と、を含み、25℃での貯蔵弾性率に対する250℃での貯蔵弾性率の割合が20%以上の硬化物を生成する、アクリル樹脂組成物。【選択図】図1
ACRYLIC RESIN COMPOSITION AND PANEL MATERIAL FOR BUILDING
To form a cured product that does not suffer a significant decrease in elastic modulus even at high temperatures, from an acrylic resin composition that is low in viscosity compared to epoxy resin and the like and can also be cured at low temperatures.SOLUTION: An acrylic resin composition comprises a polymerizable compound comprising at least one monomer mi (1≤i≤N) and a curing agent and gives a cured product with the ratio of a storage modulus at 250°C to that at 25°C being 20% or more.SELECTED DRAWING: Figure 1
【課題】エポキシ樹脂等に比べて低粘度であり、かつ低温で硬化が可能なアクリル樹脂組成物から、高温下でも弾性率が大きく低下しない硬化物を生成させる。【解決手段】1種以上のモノマーmi(1≦i≦N)を含む重合性化合物と、硬化剤と、を含み、25℃での貯蔵弾性率に対する250℃での貯蔵弾性率の割合が20%以上の硬化物を生成する、アクリル樹脂組成物。【選択図】図1
ACRYLIC RESIN COMPOSITION AND PANEL MATERIAL FOR BUILDING
アクリル樹脂組成物および建築物用パネル材
NISHIDA HIROFUMI (Autor:in)
02.05.2023
Patent
Elektronische Ressource
Japanisch
IPC:
C08F
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
,
Makromolekulare Verbindungen, erhalten durch Reaktionen, an denen nur ungesättigte Kohlenstoff-Kohlenstoff-Bindungen beteiligt sind
/
E04B
Allgemeine Baukonstruktionen
,
GENERAL BUILDING CONSTRUCTIONS
/
E04C
STRUCTURAL ELEMENTS
,
Bauelemente
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