Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
SEMIFLEXIBLE PAVEMENT BODY AND POWER SUPPLY DEVICE BURYING STRUCTURE
To make a semiflexible pavement body have a structure that is suitable to bury a power supply device for contactlessly supplying power to a power reception device provided on a movable body while maintaining resistance against plastic deformation.SOLUTION: A semiflexible pavement body is formed by impregnating an open-graded asphalt mixture layer with cement-based solidifying liquid. The cement-based solidifying liquid permeating a lower layer part contains a high heat conductive material having higher thermal conductivity than the cement-based solidifying liquid.SELECTED DRAWING: Figure 2
【課題】半たわみ性舗装体を、塑性変形抵抗性を維持しつつ、移動体に設けられた受電装置に非接触で給電を行う給電装置の埋設に適した構造とすることである。【解決手段】開粒度アスファルト混合物層にセメント系固化液を浸透させた半たわみ性舗装体であって、下層部分に浸透させた前記セメント系固化液に、該セメント系固化液より高い熱伝導性を有する高熱伝導性材料が含まれている。【選択図】図２
SEMIFLEXIBLE PAVEMENT BODY AND POWER SUPPLY DEVICE BURYING STRUCTURE
To make a semiflexible pavement body have a structure that is suitable to bury a power supply device for contactlessly supplying power to a power reception device provided on a movable body while maintaining resistance against plastic deformation.SOLUTION: A semiflexible pavement body is formed by impregnating an open-graded asphalt mixture layer with cement-based solidifying liquid. The cement-based solidifying liquid permeating a lower layer part contains a high heat conductive material having higher thermal conductivity than the cement-based solidifying liquid.SELECTED DRAWING: Figure 2
【課題】半たわみ性舗装体を、塑性変形抵抗性を維持しつつ、移動体に設けられた受電装置に非接触で給電を行う給電装置の埋設に適した構造とすることである。【解決手段】開粒度アスファルト混合物層にセメント系固化液を浸透させた半たわみ性舗装体であって、下層部分に浸透させた前記セメント系固化液に、該セメント系固化液より高い熱伝導性を有する高熱伝導性材料が含まれている。【選択図】図２
SEMIFLEXIBLE PAVEMENT BODY AND POWER SUPPLY DEVICE BURYING STRUCTURE
半たわみ性舗装体、及び給電装置の埋設構造
KUBOTA TAKAYUKI (Autor:in) / KAWAKAMI YOSHIHIRO (Autor:in)
22.11.2023
Patent
Elektronische Ressource
Japanisch
IPC:
H02J
CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER
,
Schaltungsanordnungen oder Systeme für die Abgabe oder Verteilung elektrischer Leistung
/
E01C
Bau von Straßen, Sportplätzen oder dgl., Decken dafür
,
CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE
POWER SUPPLY DEVICE BURYING STRUCTURE AND POWER SUPPLY DEVICE BURYING METHOD
| Europäisches Patentamt | 2023
POWER SUPPLY DEVICE BURYING STRUCTURE AND POWER SUPPLY DEVICE BURYING METHOD
| Europäisches Patentamt | 2023