Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
COPPER/CERAMIC CONJUGATE, AND INSULATION CIRCUIT BOARD
To provide a copper/ceramic conjugate which is improved in bondability of a ceramic member and a copper member and improved in cooling/heating cycle reliability even in a case where a severe cooling/heating cycle is loaded.SOLUTION: A copper/ceramic conjugate is configured by bonding a copper member 12 consisting of copper or copper alloy with a ceramic member 11. An active metal compound layer 31 containing a compound of one or two or more active metals selected from among Ti, Zr, Nb and Hf is formed in a region at the side of the copper member 12 in the ceramic member 11. A transition metal layer 34 containing one or two or more transition metals selected from among V, Cr, Mn, Fe, Co, Ni, Mo, Ta and W is formed on an interface at the side of the copper member 12 in the active metal compound layer 31.SELECTED DRAWING: Figure 2
【課題】厳しい冷熱サイクルを負荷した場合であっても、セラミックス部材と銅部材との接合性に優れ、冷熱サイクル信頼性に優れた銅／セラミックス接合体を提供する。【解決手段】銅又は銅合金からなる銅部材１２と、セラミックス部材１１とが接合されてなる銅／セラミックス接合体であって、セラミックス部材１１のうち銅部材１２側の領域には、Ｔｉ，Ｚｒ，Ｎｂ，Ｈｆから選択される一種又は二種以上の活性金属の化合物を含む活性金属化合物層３１が形成されており、活性金属化合物層３１のうち銅部材１２側の界面には、Ｖ，Ｃｒ，Ｍｎ，Ｆｅ，Ｃｏ，Ｎｉ，Ｍｏ，Ｔａ，Ｗから選択される一種又は二種以上の遷移金属を含む遷移金属層３４が形成されている。【選択図】図２
COPPER/CERAMIC CONJUGATE, AND INSULATION CIRCUIT BOARD
To provide a copper/ceramic conjugate which is improved in bondability of a ceramic member and a copper member and improved in cooling/heating cycle reliability even in a case where a severe cooling/heating cycle is loaded.SOLUTION: A copper/ceramic conjugate is configured by bonding a copper member 12 consisting of copper or copper alloy with a ceramic member 11. An active metal compound layer 31 containing a compound of one or two or more active metals selected from among Ti, Zr, Nb and Hf is formed in a region at the side of the copper member 12 in the ceramic member 11. A transition metal layer 34 containing one or two or more transition metals selected from among V, Cr, Mn, Fe, Co, Ni, Mo, Ta and W is formed on an interface at the side of the copper member 12 in the active metal compound layer 31.SELECTED DRAWING: Figure 2
【課題】厳しい冷熱サイクルを負荷した場合であっても、セラミックス部材と銅部材との接合性に優れ、冷熱サイクル信頼性に優れた銅／セラミックス接合体を提供する。【解決手段】銅又は銅合金からなる銅部材１２と、セラミックス部材１１とが接合されてなる銅／セラミックス接合体であって、セラミックス部材１１のうち銅部材１２側の領域には、Ｔｉ，Ｚｒ，Ｎｂ，Ｈｆから選択される一種又は二種以上の活性金属の化合物を含む活性金属化合物層３１が形成されており、活性金属化合物層３１のうち銅部材１２側の界面には、Ｖ，Ｃｒ，Ｍｎ，Ｆｅ，Ｃｏ，Ｎｉ，Ｍｏ，Ｔａ，Ｗから選択される一種又は二種以上の遷移金属を含む遷移金属層３４が形成されている。【選択図】図２
COPPER/CERAMIC CONJUGATE, AND INSULATION CIRCUIT BOARD
銅／セラミックス接合体、および、絶縁回路基板
TERASAKI NOBUYUKI (Autor:in)
22.03.2024
Patent
Elektronische Ressource
Japanisch
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