LOW-EMISSIVITY HEAT INSULATIVE COATED BOARD BUILDING MATERIAL INCLUDING THE SAME AND METHOD FOR PREPARING LOW-EMISSIVITY HEAT INSULATIVE COATED BOARD: Fid-Bau Portal

LOW-EMISSIVITY HEAT INSULATIVE COATED BOARD BUILDING MATERIAL INCLUDING THE SAME AND METHOD FOR PREPARING LOW-EMISSIVITY HEAT INSULATIVE COATED BOARD

Abstract

기재 및 코팅층을 포함하고, 상기 코팅층은 상기 기재로부터 저방사 전기전도층, 유전체층 및 광흡수 금속층을 순차적으로 포함하는 다층 구조인 저방사 단열 코팅막, 이를 적용한 건축 자재 및 저방사 단열 코팅막 제조 방법 이 제공된다.

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LOW-EMISSIVITY HEAT INSULATIVE COATED BOARD BUILDING MATERIAL INCLUDING THE SAME AND METHOD FOR PREPARING LOW-EMISSIVITY HEAT INSULATIVE COATED BOARD

Abstract

LOW-EMISSIVITY HEAT INSULATIVE COATED BOARD BUILDING MATERIAL INCLUDING THE SAME AND METHOD FOR PREPARING LOW-EMISSIVITY HEAT INSULATIVE COATED BOARD

Abstract

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Titel:

LOW-EMISSIVITY HEAT INSULATIVE COATED BOARD BUILDING MATERIAL INCLUDING THE SAME AND METHOD FOR PREPARING LOW-EMISSIVITY HEAT INSULATIVE COATED BOARD

Weitere Titelangaben:

저방사 단열 코팅막, 이를 포함하는 건축 자재 및 저방사 단열 코팅막 제조 방법

Erscheinungsdatum:

10.08.2015

Medientyp:

Patent

Format:

Elektronische Ressource

Sprache:

Koreanisch

Klassifikation:

IPC: C03C Chemische Zusammensetzungen für Gläser, Glasuren oder Emails , CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS / E04B Allgemeine Baukonstruktionen , GENERAL BUILDING CONSTRUCTIONS

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