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cleanroom concrete floor penetrating hole closing unit composition for manufacturing semiconductor and cleanroom concrete floor penetrating hole closing unit for manufacturing semiconductor comprising the same
The present invention relates to a cleanroom concrete floor through-hole finishing unit composition for semiconductor manufacturing and a cleanroom concrete floor through-hole finishing unit for semiconductor manufacturing comprising the same, and more particularly to a cleanroom concrete floor through-hole finishing unit composition for semiconductor manufacturing and a cleanroom concrete floor through-hole finishing unit for semiconductor manufacturing comprising the same, having excellent non-combustible properties and also being eco-friendly due to low gas toxicity. In the cleanroom concrete floor through-hole finishing unit composition for semiconductor manufacturing comprising the finishing unit powder, the finishing unit powder includes, based on 100 parts by weight of dolomite having an average particle diameter of 5 to 20 mm, 43 to 48 parts by weight of silica sand having an average particle diameter of 0.1 to 1 mm; 5.8 to 6.5 parts by weight of serpentine having an average particle diameter of 3 to 10 mm; and 1.34 to 1.49 parts by weight of chopped glass fiber having a length of 3 to 10 mm.
본 발명은 반도체 제조용 클린룸 콘크리트 바닥 관통홀 마감유닛 조성물 및 이를 포함하는 반도체 제조용 클린룸 콘크리트 바닥 관통홀 마감유닛에 관한 것으로써, 보다 상세하게는 우수한 불연특성을 가질 뿐만 아니라, 가스유해성이 낮아 친환경적인 반도체 제조용 클린룸 콘크리트 바닥 관통홀 마감유닛 조성물 및 이를 포함하는 반도체 제조용 클린룸 콘크리트 바닥 관통홀 마감유닛에 관한 것이다.
cleanroom concrete floor penetrating hole closing unit composition for manufacturing semiconductor and cleanroom concrete floor penetrating hole closing unit for manufacturing semiconductor comprising the same
The present invention relates to a cleanroom concrete floor through-hole finishing unit composition for semiconductor manufacturing and a cleanroom concrete floor through-hole finishing unit for semiconductor manufacturing comprising the same, and more particularly to a cleanroom concrete floor through-hole finishing unit composition for semiconductor manufacturing and a cleanroom concrete floor through-hole finishing unit for semiconductor manufacturing comprising the same, having excellent non-combustible properties and also being eco-friendly due to low gas toxicity. In the cleanroom concrete floor through-hole finishing unit composition for semiconductor manufacturing comprising the finishing unit powder, the finishing unit powder includes, based on 100 parts by weight of dolomite having an average particle diameter of 5 to 20 mm, 43 to 48 parts by weight of silica sand having an average particle diameter of 0.1 to 1 mm; 5.8 to 6.5 parts by weight of serpentine having an average particle diameter of 3 to 10 mm; and 1.34 to 1.49 parts by weight of chopped glass fiber having a length of 3 to 10 mm.
본 발명은 반도체 제조용 클린룸 콘크리트 바닥 관통홀 마감유닛 조성물 및 이를 포함하는 반도체 제조용 클린룸 콘크리트 바닥 관통홀 마감유닛에 관한 것으로써, 보다 상세하게는 우수한 불연특성을 가질 뿐만 아니라, 가스유해성이 낮아 친환경적인 반도체 제조용 클린룸 콘크리트 바닥 관통홀 마감유닛 조성물 및 이를 포함하는 반도체 제조용 클린룸 콘크리트 바닥 관통홀 마감유닛에 관한 것이다.
cleanroom concrete floor penetrating hole closing unit composition for manufacturing semiconductor and cleanroom concrete floor penetrating hole closing unit for manufacturing semiconductor comprising the same
반도체 제조용 클린룸 콘크리트 바닥 관통홀 마감유닛 조성물 및 이를 포함하는 반도체 제조용 클린룸 콘크리트 바닥 관통홀 마감유닛
YOON JONG WON (Autor:in)
08.09.2021
Patent
Elektronische Ressource
Koreanisch
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