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CHIP INLAID FLOORING SHEET USING POLYLACTIC ACID RESIN
Provided is a chip inlaid flooring sheet including a transparent layer, chip inlaid layer, and a substrate layer from the top, wherein any one or more among the transparent layer and the chip inlaid layer includes a PLA resin, the substrate layer includes a PLA resin or a synthetic resin.
CHIP INLAID FLOORING SHEET USING POLYLACTIC ACID RESIN
Provided is a chip inlaid flooring sheet including a transparent layer, chip inlaid layer, and a substrate layer from the top, wherein any one or more among the transparent layer and the chip inlaid layer includes a PLA resin, the substrate layer includes a PLA resin or a synthetic resin.
CHIP INLAID FLOORING SHEET USING POLYLACTIC ACID RESIN
KO HAE SEUNG (Autor:in)
23.09.2015
Patent
Elektronische Ressource
Koreanisch
IPC:
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
,
Ausbau von Bauwerken, z.B. Treppen, Fußböden