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Floor structure for reducing inter-floor noise
The present invention relates to a floor structure for reducing noise between floors, comprising: a slab; an insulation layer formed on top of the slab; a plain concrete layer formed by pouring concrete on top of the insulation layer; a buffer layer formed on top of the plain concrete layer; and a cement mortar layer formed by pouring cement mortar on top of the buffer layer. The floor structure reduces noise between floors and prevents a sagging defect due to upper load.
본 발명은 층간소음 저감을 위한 바닥 구조에 관한 것으로, 슬래브; 상기 슬래브 상부에 형성되는 단열재층; 상기 단열재층 상부에 콘크리트를 타설하여 형성되는 무근 콘크리트층; 상기 무근 콘크리트층 상부에 형성되는 완충재층; 상기 완충재층 상부에 시멘트 모르타르를 타설하여 형성되는 시멘트 모르타르층;을 포함하는 것을 특징으로 하는 것이다.
Floor structure for reducing inter-floor noise
The present invention relates to a floor structure for reducing noise between floors, comprising: a slab; an insulation layer formed on top of the slab; a plain concrete layer formed by pouring concrete on top of the insulation layer; a buffer layer formed on top of the plain concrete layer; and a cement mortar layer formed by pouring cement mortar on top of the buffer layer. The floor structure reduces noise between floors and prevents a sagging defect due to upper load.
본 발명은 층간소음 저감을 위한 바닥 구조에 관한 것으로, 슬래브; 상기 슬래브 상부에 형성되는 단열재층; 상기 단열재층 상부에 콘크리트를 타설하여 형성되는 무근 콘크리트층; 상기 무근 콘크리트층 상부에 형성되는 완충재층; 상기 완충재층 상부에 시멘트 모르타르를 타설하여 형성되는 시멘트 모르타르층;을 포함하는 것을 특징으로 하는 것이다.
Floor structure for reducing inter-floor noise
층간소음 저감을 위한 바닥 구조
JANG JAE HEE (Autor:in) / SON SEONG KOO (Autor:in) / BAHK CHAAN AH (Autor:in)
14.09.2022
Patent
Elektronische Ressource
Koreanisch
IPC:
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
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Ausbau von Bauwerken, z.B. Treppen, Fußböden
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