Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Method for improved semiconductor processing equipment tool pedestal / pad vibration isolation and reduction
A method to improve vibration isolation in semiconductor process level inhibits vibration frequencies transmitted through building structure from production tools, pumps, compressors, chillers, AHUs (Air Handling Units), and footfalls traffic on raised floor system on to tool pedestals and pads from affecting semiconductor fabrication processes. Rapid advancement and technological evolution in semiconductor industry foresee the imminent requirements for decrease in semiconductor chip node sizes to single digit nanometer. Dealing with such advancements, the tool pedestal systems are also requiring tighter specifications for stiffness and vibration isolation/reduction. Some key tools used in the semiconductor fabrication process require improved barrier from electromagnetic interference (EMI), as the disturbance from EMI degrade the performance of semiconductor processing tools that are key to the fabrication process and production yield rate.
Method for improved semiconductor processing equipment tool pedestal / pad vibration isolation and reduction
A method to improve vibration isolation in semiconductor process level inhibits vibration frequencies transmitted through building structure from production tools, pumps, compressors, chillers, AHUs (Air Handling Units), and footfalls traffic on raised floor system on to tool pedestals and pads from affecting semiconductor fabrication processes. Rapid advancement and technological evolution in semiconductor industry foresee the imminent requirements for decrease in semiconductor chip node sizes to single digit nanometer. Dealing with such advancements, the tool pedestal systems are also requiring tighter specifications for stiffness and vibration isolation/reduction. Some key tools used in the semiconductor fabrication process require improved barrier from electromagnetic interference (EMI), as the disturbance from EMI degrade the performance of semiconductor processing tools that are key to the fabrication process and production yield rate.
Method for improved semiconductor processing equipment tool pedestal / pad vibration isolation and reduction
KIM-WHITTY SUK K (Autor:in)
30.10.2018
Patent
Elektronische Ressource
Englisch
IPC:
F16F
SPRINGS
,
Federn
/
E04B
Allgemeine Baukonstruktionen
,
GENERAL BUILDING CONSTRUCTIONS
/
E04C
STRUCTURAL ELEMENTS
,
Bauelemente
/
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
,
Ausbau von Bauwerken, z.B. Treppen, Fußböden
/
F16M
Rahmen, Gehäuse oder Grundplatten von Kraftmaschinen oder anderen Maschinen oder von Apparaten, nicht auf eine besondere Art von Maschine oder Apparat eingeschränkt, die anderweitig vorgesehen ist
,
FRAMES, CASINGS, OR BEDS, OF ENGINES OR OTHER MACHINES OR APPARATUS, NOT SPECIFIC TO AN ENGINE, MACHINE, OR APPARATUS PROVIDED FOR ELSEWHERE
/
G03F
Fotomechanische Herstellung strukturierter oder gemusterter Oberflächen, z.B. zum Drucken, zum Herstellen von Halbleiterbauelementen
,
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
/
H02K
Dynamoelektrische Maschinen
,
DYNAMO-ELECTRIC MACHINES
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