Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Thermally stable polycrystalline diamond with enhanced attachment joint
The present disclosure relates to an industrial device, such as a drill bit including a thermally stable polycrystalline diamond (TSP) table coupled to a substrate via an attachment joint, with at least one attachment material located in the attachment joint. At least one of the attachment materials includes a metal or metal alloy and an additive material having a hardness higher than the metal or metal alloy or a coefficient of thermal expansion lower than that of the metal or metal alloy.
Thermally stable polycrystalline diamond with enhanced attachment joint
The present disclosure relates to an industrial device, such as a drill bit including a thermally stable polycrystalline diamond (TSP) table coupled to a substrate via an attachment joint, with at least one attachment material located in the attachment joint. At least one of the attachment materials includes a metal or metal alloy and an additive material having a hardness higher than the metal or metal alloy or a coefficient of thermal expansion lower than that of the metal or metal alloy.
Thermally stable polycrystalline diamond with enhanced attachment joint
ANDERLE SETH GARRETT (Autor:in) / KNUTESON CODY WILLIAM (Autor:in)
26.03.2019
Patent
Elektronische Ressource
Englisch
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