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Heat-insulation film, and heat-insulation-film structure
In a heat-insulation film, porous plate fillers are dispersed in a matrix to bond the porous plate fillers. The porous plate filler includes plates having an aspect ratio of 3 or more, a minimum length of 0.1 to 50 μm and a porosity of 20 to 90%. In the heat-insulation film, a volume ratio between the porous plate fillers and the matrix is from 50:50 to 95:5. In the heat-insulation film in which the porous plate fillers are used, a length of a heat transfer path increases and a thermal conductivity can be decreased, as compared with a case where spherical or cubic fillers are used.
Heat-insulation film, and heat-insulation-film structure
In a heat-insulation film, porous plate fillers are dispersed in a matrix to bond the porous plate fillers. The porous plate filler includes plates having an aspect ratio of 3 or more, a minimum length of 0.1 to 50 μm and a porosity of 20 to 90%. In the heat-insulation film, a volume ratio between the porous plate fillers and the matrix is from 50:50 to 95:5. In the heat-insulation film in which the porous plate fillers are used, a length of a heat transfer path increases and a thermal conductivity can be decreased, as compared with a case where spherical or cubic fillers are used.
Heat-insulation film, and heat-insulation-film structure
KOBAYASHI HIROHARU (Autor:in) / TOMITA TAKAHIRO (Autor:in) / ORIBE AKINOBU (Autor:in)
20.08.2019
Patent
Elektronische Ressource
Englisch
IPC:
C08K
Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe
,
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
C04B
Kalk
,
LIME
/
F02F
CYLINDERS, PISTONS, OR CASINGS FOR COMBUSTION ENGINES
,
Zylinder, Kolben oder Gehäuse für Brennkraftmaschinen
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