Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Hemming structure for hybrid-type door
Disclosed is a structure for a hybrid-type door, which is capable of preventing deformation caused by difference in thermal expansion coefficient between an outer panel of aluminum alloy and an inner panel of iron steel. The structure for a hybrid-type door may include an inner panel and an outer panel made of different material from the inner panel. In particular, an end portion of the inner panel may be hemmed by an end portion of the outer panel with the end portions of the inner panel and the outer panel being brought into contact with each other. A sealer may be applied to a contact area at which the inner panel and the outer panel are brought into contact with each other, and the sealer may include a first sealer that may be curable at a room temperature, and a second sealer that may be curable at a temperature greater than a curing temperature of the first sealer.
Hemming structure for hybrid-type door
Disclosed is a structure for a hybrid-type door, which is capable of preventing deformation caused by difference in thermal expansion coefficient between an outer panel of aluminum alloy and an inner panel of iron steel. The structure for a hybrid-type door may include an inner panel and an outer panel made of different material from the inner panel. In particular, an end portion of the inner panel may be hemmed by an end portion of the outer panel with the end portions of the inner panel and the outer panel being brought into contact with each other. A sealer may be applied to a contact area at which the inner panel and the outer panel are brought into contact with each other, and the sealer may include a first sealer that may be curable at a room temperature, and a second sealer that may be curable at a temperature greater than a curing temperature of the first sealer.
Hemming structure for hybrid-type door
CHOI KI HYUN (Autor:in) / KIM JAI HAK (Autor:in)
19.05.2020
Patent
Elektronische Ressource
Englisch
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