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Engineered stone and manufacturing method thereof
An engineered stone includes a light transmitting mother material (I) and a phosphorescent chip (II). The light transmitting mother material (I) includes about 7 wt % to about 12 wt % of an unsaturated polyester resin (A), about 88 wt % to about 93 wt % of a silica-containing compound (B) and about 0.01 part by weight to about 1 part by weight of an organic/inorganic pigment (C) based on about 100 parts by weight of the unsaturated polyester resin (A). The phosphorescent chip (II) includes about 8 wt % to about 15 wt % of an unsaturated polyester resin (A′), about 85 wt % to about 92 wt % of a silica-containing compound (B′) and about 2 parts by weight to about 10 parts by weight of a phosphorescent pigment (D) based on about 100 parts by weight of the unsaturated polyester resin (A′).
Engineered stone and manufacturing method thereof
An engineered stone includes a light transmitting mother material (I) and a phosphorescent chip (II). The light transmitting mother material (I) includes about 7 wt % to about 12 wt % of an unsaturated polyester resin (A), about 88 wt % to about 93 wt % of a silica-containing compound (B) and about 0.01 part by weight to about 1 part by weight of an organic/inorganic pigment (C) based on about 100 parts by weight of the unsaturated polyester resin (A). The phosphorescent chip (II) includes about 8 wt % to about 15 wt % of an unsaturated polyester resin (A′), about 85 wt % to about 92 wt % of a silica-containing compound (B′) and about 2 parts by weight to about 10 parts by weight of a phosphorescent pigment (D) based on about 100 parts by weight of the unsaturated polyester resin (A′).
Engineered stone and manufacturing method thereof
LEE HEECHEOL (Autor:in) / HWANG CHEOL-YEON (Autor:in) / KIM KYUNGHWAN (Autor:in) / BAE SEUL-GI (Autor:in) / SON CHANGHO (Autor:in) / AN SUNG JIN (Autor:in)
08.09.2020
Patent
Elektronische Ressource
Englisch
IPC:
C04B
Kalk
,
LIME
/
B29C
Formen oder Verbinden von Kunststoffen
,
SHAPING OR JOINING OF PLASTICS
/
B29K
Index-Schema für Formmassen oder Materialien für Verstärkungen, Füllstoffe oder vorgeformte Teile, z.B. Einlagen in Verbindung mit den Unterklassen B29B, B29C oder B29D
,
INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
/
C09K
Materialien für Anwendungen, soweit nicht anderweitig vorgesehen
,
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR
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