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Hexagonal boron nitride thermal conductivity enhancing materials and method of making
A porous hexagonal boron nitride (h-BN) material with thermally conductive properties, includes a network of interconnected struts and nodes. The porous h-BN material is formed by depositing h-BN onto a catalyst foam using chemical vapor deposition at atmospheric pressure. The catalyst foam with the h-BN layer deposited thereon is then encapsulated with an insulating material. After the insulating material layer is cured, the h-BN structure is cut on an edge and then wet-etched to at least partially remove the catalyst foam.
Hexagonal boron nitride thermal conductivity enhancing materials and method of making
A porous hexagonal boron nitride (h-BN) material with thermally conductive properties, includes a network of interconnected struts and nodes. The porous h-BN material is formed by depositing h-BN onto a catalyst foam using chemical vapor deposition at atmospheric pressure. The catalyst foam with the h-BN layer deposited thereon is then encapsulated with an insulating material. After the insulating material layer is cured, the h-BN structure is cut on an edge and then wet-etched to at least partially remove the catalyst foam.
Hexagonal boron nitride thermal conductivity enhancing materials and method of making
MOORE ARDEN L (Autor:in)
22.09.2020
Patent
Elektronische Ressource
Englisch
IPC:
C08K
Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe
,
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
/
C01B
NON-METALLIC ELEMENTS
,
Nichtmetallische Elemente
/
C04B
Kalk
,
LIME
/
C09K
Materialien für Anwendungen, soweit nicht anderweitig vorgesehen
,
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR
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