Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Siding panel and assembly to address dimpling
The present disclosure describes composite siding panels with a structure that reduces dimpling. The siding panel comprises a backing member and a siding member that are joined by an adhesive layer. The adhesive layer may be made with fingers extending from its sides, or may be made with an adhesive that has an elongation factor of at least 1000%. These reduce dimpling.
Siding panel and assembly to address dimpling
The present disclosure describes composite siding panels with a structure that reduces dimpling. The siding panel comprises a backing member and a siding member that are joined by an adhesive layer. The adhesive layer may be made with fingers extending from its sides, or may be made with an adhesive that has an elongation factor of at least 1000%. These reduce dimpling.
Siding panel and assembly to address dimpling
CULPEPPER PATRICK M (Autor:in) / BEACH RYAN (Autor:in)
16.02.2021
Patent
Elektronische Ressource
Englisch
IPC:
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
,
Ausbau von Bauwerken, z.B. Treppen, Fußböden