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Brazed joint and semiconductor processing chamber component having the same
Methods of forming a metallic-ceramic brazed joint are disclosed herein. The method of forming the brazed joint includes deoxidizing the surface of metallic components, assembling the joint, heating the joint to fuse the joint components, and cooling the joint. In certain embodiments, the brazed joint includes a conformal layer. In further embodiments, the brazed joint has features in order to reduce stress concentrations within the joint.
Brazed joint and semiconductor processing chamber component having the same
Methods of forming a metallic-ceramic brazed joint are disclosed herein. The method of forming the brazed joint includes deoxidizing the surface of metallic components, assembling the joint, heating the joint to fuse the joint components, and cooling the joint. In certain embodiments, the brazed joint includes a conformal layer. In further embodiments, the brazed joint has features in order to reduce stress concentrations within the joint.
Brazed joint and semiconductor processing chamber component having the same
RAJ GOVINDA (Autor:in) / CHO TOM K (Autor:in) / MOHIUDDIN HAMID (Autor:in) / WIDLOW IAN (Autor:in)
24.01.2023
Patent
Elektronische Ressource
Englisch
IPC:
B23K
Löten
,
SOLDERING OR UNSOLDERING
/
C04B
Kalk
,
LIME
/
F16B
DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES
,
Vorrichtungen zum Befestigen oder Sichern von Konstruktionselementen oder Maschinenteilen, z.B. Nägel, Bolzen, Schrauben, Sprengringe, Klemmen, Klammern oder Keile
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|