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Composite sintered body, semiconductor manufacturing apparatus member and method of producing composite sintered body
A composite sintered body includes a base material that contains Al2O3 as a main component, and an electrode arranged inside or on a surface of the base material. The electrode contains Ru, ZrO2, and Al2O3.
Composite sintered body, semiconductor manufacturing apparatus member and method of producing composite sintered body
A composite sintered body includes a base material that contains Al2O3 as a main component, and an electrode arranged inside or on a surface of the base material. The electrode contains Ru, ZrO2, and Al2O3.
Composite sintered body, semiconductor manufacturing apparatus member and method of producing composite sintered body
MIYANISHI KEITA (Autor:in) / ATSUJI KYOHEI (Autor:in) / NAGAI ASUMI (Autor:in) / YAMAGUCHI HIROFUMI (Autor:in) / AOYAGI SOICHIRO (Autor:in)
28.11.2023
Patent
Elektronische Ressource
Englisch
IPC:
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
C04B
Kalk
,
LIME
| Europäisches Patentamt | 2024
Europäisches Patentamt | 2022
| Europäisches Patentamt | 2022
Europäisches Patentamt | 2024
| Europäisches Patentamt | 2022