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Cutting elements with modified diamond surface
Cutting elements include a carbonate diamond-bonded body that is sintered under HPHT conditions in the presence of a carbonate material, where the body includes a matrix phase of intercrystalline bonded diamond with interstitial regions including the carbonate material, where the diamond-bonded body is sintered without a substrate. A matrix casting is formed and mechanically coupled to the body after the body is sintered, and a portion of the body surface is exposed along a surface of the matrix casting. The exposed body surface is thereafter intentionally treated to induce a compressive residual surface stress that is greater than a remaining portion of the body. The compressive residual surface stress is less than about 500 MPa, and from about 100 to 500 MPa, and a remaining region the body may have a residual stress of less than about 300 MPa, and less than about 100 MPa.
Cutting elements with modified diamond surface
Cutting elements include a carbonate diamond-bonded body that is sintered under HPHT conditions in the presence of a carbonate material, where the body includes a matrix phase of intercrystalline bonded diamond with interstitial regions including the carbonate material, where the diamond-bonded body is sintered without a substrate. A matrix casting is formed and mechanically coupled to the body after the body is sintered, and a portion of the body surface is exposed along a surface of the matrix casting. The exposed body surface is thereafter intentionally treated to induce a compressive residual surface stress that is greater than a remaining portion of the body. The compressive residual surface stress is less than about 500 MPa, and from about 100 to 500 MPa, and a remaining region the body may have a residual stress of less than about 300 MPa, and less than about 100 MPa.
Cutting elements with modified diamond surface
BELNAP JOHN DANIEL (Autor:in) / BAO YAHUA (Autor:in)
12.12.2023
Patent
Elektronische Ressource
Englisch
Europäisches Patentamt | 2019
|Europäisches Patentamt | 2018
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