Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Heat dissipation member and method of manufacturing the same
A plate-shaped heat dissipation member includes a metal-silicon carbide composite containing aluminum or magnesium, in which at least one of two main surfaces of the heat dissipation member is curved to be convex in an outward direction of the heat dissipation member, and when a flatness of the one main surface defined by JIS B 0621 is represented by f1 and a flatness of the other main surface different from the one main surface defined by JIS B 0621 is represented by f2, f2 is less than f1 by 10 μm or more.
Heat dissipation member and method of manufacturing the same
A plate-shaped heat dissipation member includes a metal-silicon carbide composite containing aluminum or magnesium, in which at least one of two main surfaces of the heat dissipation member is curved to be convex in an outward direction of the heat dissipation member, and when a flatness of the one main surface defined by JIS B 0621 is represented by f1 and a flatness of the other main surface different from the one main surface defined by JIS B 0621 is represented by f2, f2 is less than f1 by 10 μm or more.
Heat dissipation member and method of manufacturing the same
GOTO DAISUKE (Autor:in) / OTA HIROAKI (Autor:in)
28.01.2025
Patent
Elektronische Ressource
Englisch
IPC:
H05K
PRINTED CIRCUITS
,
Gedruckte Schaltungen
/
C04B
Kalk
,
LIME
/
C22C
Legierungen
,
ALLOYS
/
F28F
Einzelheiten von Wärmetauschern oder Wärmeübertragungsvorrichtungen für allgemeine Verwendung
,
DETAILS OF HEAT-EXCHANGE OR HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
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