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    HEAT-DISSIPATING COMPONENT AND METHOD FOR MANUFACTURING SAME

    Neue Suche nach: MIYAKAWA TAKESHI
    Neue Suche nach: KINO MOTONORI

    A heat-dissipating component, and a method for manufacturing the same, the component provided with a composited portion including a plate-shaped molded body containing silicon carbide, and hole-formation portions formed in a peripheral edge portion of the composited portion; through-holes being formed in the hole formation sections; the hole-formation portions containing inorganic fibers; the molded body and the inorganic fibers being impregnated with an aluminum-containing metal; and the hole-formation portions forming a part of the outer peripheral surface of the heat-dissipating component.

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    HEAT-DISSIPATING COMPONENT AND METHOD FOR MANUFACTURING SAME

    Neue Suche nach: MIYAKAWA TAKESHI
    Neue Suche nach: KINO MOTONORI

    A heat-dissipating component, and a method for manufacturing the same, the component provided with a composited portion including a plate-shaped molded body containing silicon carbide, and hole-formation portions formed in a peripheral edge portion of the composited portion; through-holes being formed in the hole formation sections; the hole-formation portions containing inorganic fibers; the molded body and the inorganic fibers being impregnated with an aluminum-containing metal; and the hole-formation portions forming a part of the outer peripheral surface of the heat-dissipating component.

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    HEAT-DISSIPATING COMPONENT AND METHOD FOR MANUFACTURING SAME

    Neue Suche nach: MIYAKAWA TAKESHI
    Neue Suche nach: KINO MOTONORI

    A heat-dissipating component, and a method for manufacturing the same, the component provided with a composited portion including a plate-shaped molded body containing silicon carbide, and hole-formation portions formed in a peripheral edge portion of the composited portion; through-holes being formed in the hole formation sections; the hole-formation portions containing inorganic fibers; the molded body and the inorganic fibers being impregnated with an aluminum-containing metal; and the hole-formation portions forming a part of the outer peripheral surface of the heat-dissipating component.

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    Titel:

    HEAT-DISSIPATING COMPONENT AND METHOD FOR MANUFACTURING SAME

    Beteiligte:

    MIYAKAWA TAKESHI (Autor:in) / KINO MOTONORI (Autor:in)

    Erscheinungsdatum:

    18.05.2017

    Medientyp:

    Patent

    Format:

    Elektronische Ressource

    Sprache:

    Englisch

    Klassifikation:

    IPC:  H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B22D CASTING OF METALS , Gießen von Metallen / C04B Kalk , LIME / C09K Materialien für Anwendungen, soweit nicht anderweitig vorgesehen , MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR / C22C Legierungen , ALLOYS

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