Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
A subfloor leveling assembly includes a leveling device, plurality of panels and an adhesive. The leveling device is configured to identify a high spot and a low spot of a subfloor. The panels are rectangularly shaped and are configured to be vertically adjustable relative to the subfloor. Top faces of the panels are coplanarly positionable. The adhesive is configured to couple the plurality of panels to the subfloor.
A subfloor leveling assembly includes a leveling device, plurality of panels and an adhesive. The leveling device is configured to identify a high spot and a low spot of a subfloor. The panels are rectangularly shaped and are configured to be vertically adjustable relative to the subfloor. Top faces of the panels are coplanarly positionable. The adhesive is configured to couple the plurality of panels to the subfloor.
Subfloor Leveling Assembly
MIECZKOWSKI MARCIN (Autor:in)
10.05.2018
Patent
Elektronische Ressource
Englisch