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Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
POLYCRYSTALLINE CERAMIC SUBSTRATE, BONDING-LAYER-INCLUDING POLYCRYSTALLINE CERAMIC SUBSTRATE, AND LAMINATED SUBSTRATE
Provided is a polycrystalline ceramic substrate to be bonded to a compound semiconductor substrate with a bonding layer interposed therebetween, wherein at least one of relational expression (1) 0.7<α1/α2<0.9 and relational expression (2) 0.7<α3/α4<0.9 holds, where α1 represents a linear expansion coefficient of the polycrystalline ceramic substrate at 30° C. to 300° C. and α2 represents a linear expansion coefficient of the compound semiconductor substrate at 30° C. to 300° C., and α3 represents a linear expansion coefficient of the polycrystalline ceramic substrate at 30° C. to 1000° C. and α4 represents a linear expansion coefficient of the compound semiconductor substrate at 30° C. to 1000° C.
POLYCRYSTALLINE CERAMIC SUBSTRATE, BONDING-LAYER-INCLUDING POLYCRYSTALLINE CERAMIC SUBSTRATE, AND LAMINATED SUBSTRATE
Provided is a polycrystalline ceramic substrate to be bonded to a compound semiconductor substrate with a bonding layer interposed therebetween, wherein at least one of relational expression (1) 0.7<α1/α2<0.9 and relational expression (2) 0.7<α3/α4<0.9 holds, where α1 represents a linear expansion coefficient of the polycrystalline ceramic substrate at 30° C. to 300° C. and α2 represents a linear expansion coefficient of the compound semiconductor substrate at 30° C. to 300° C., and α3 represents a linear expansion coefficient of the polycrystalline ceramic substrate at 30° C. to 1000° C. and α4 represents a linear expansion coefficient of the compound semiconductor substrate at 30° C. to 1000° C.
POLYCRYSTALLINE CERAMIC SUBSTRATE, BONDING-LAYER-INCLUDING POLYCRYSTALLINE CERAMIC SUBSTRATE, AND LAMINATED SUBSTRATE
GESHI KEIICHIRO (Autor:in) / NAKAYAMA SHIGERU (Autor:in) / YOSHIMURA MASASHI (Autor:in)
02.05.2019
Patent
Elektronische Ressource
Englisch
IPC:
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
C04B
Kalk
,
LIME
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