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NITRIDE CERAMIC RESIN COMPOSITE BODY
A nitride-based ceramics resin composite body having thermal conductivity, electrical insulation, and adhesion to adherends equal to conventional products, and having improved heat resistance reliability during the reflow process, and a thermal conductive insulating adhesive sheet using the same are provided. A nitride-based ceramics resin composite body in which a thermosetting resin composition is impregnated in a porous nitride-based ceramics sintered body is provided. The thermosetting resin composition includes a specific epoxy resin and a bismaleimide triazine resin, and a water absorption of the thermosetting resin composition in a completely cured state measured in accordance with method A in JIS K7209 (2000) is 1% by mass or less.
NITRIDE CERAMIC RESIN COMPOSITE BODY
A nitride-based ceramics resin composite body having thermal conductivity, electrical insulation, and adhesion to adherends equal to conventional products, and having improved heat resistance reliability during the reflow process, and a thermal conductive insulating adhesive sheet using the same are provided. A nitride-based ceramics resin composite body in which a thermosetting resin composition is impregnated in a porous nitride-based ceramics sintered body is provided. The thermosetting resin composition includes a specific epoxy resin and a bismaleimide triazine resin, and a water absorption of the thermosetting resin composition in a completely cured state measured in accordance with method A in JIS K7209 (2000) is 1% by mass or less.
NITRIDE CERAMIC RESIN COMPOSITE BODY
MINAKATA YOSHITAKA (Autor:in) / SASAKI ERI (Autor:in) / YAMAGATA TOSHITAKA (Autor:in) / INOUE SAORI (Autor:in) / YOSHIMATU RYO (Autor:in) / KOGA RYUJI (Autor:in)
04.02.2021
Patent
Elektronische Ressource
Englisch
IPC:
C04B
Kalk
,
LIME
/
C08G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
,
Makromolekulare Verbindungen, anders erhalten als durch Reaktionen, an denen nur ungesättigte Kohlenstoff-Kohlenstoff-Bindungen beteiligt sind
/
C09J
ADHESIVES
,
Klebstoffe
/
H05K
PRINTED CIRCUITS
,
Gedruckte Schaltungen