Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
CERAMIC STRUCTURE AND WAFER SYSTEM
A heater includes a base body, a resistance heating element, and a terminal part. The base body is made of ceramic and is a plate shape. The resistance heating element is located inside the base body. The terminal part is electrically connected to the internal conductor, is located inside the base body in at least a part, and is exposed from a lower surface of the base body to an exterior of the base body. The base body includes a hole opened at the lower surface of the base body. The terminal part includes a connection conductor. The connection conductor is inserted in the hole and is connected to the internal conductor. A lower surface of the connection conductor is located on a side closer to the upper surface of the base body other than the lower surface of the base body. The hole includes a reduced-diameter portion which has a diameter smaller than a diameter of the connection conductor between the lower surface of the connection conductor and the lower surface of the base body.
CERAMIC STRUCTURE AND WAFER SYSTEM
A heater includes a base body, a resistance heating element, and a terminal part. The base body is made of ceramic and is a plate shape. The resistance heating element is located inside the base body. The terminal part is electrically connected to the internal conductor, is located inside the base body in at least a part, and is exposed from a lower surface of the base body to an exterior of the base body. The base body includes a hole opened at the lower surface of the base body. The terminal part includes a connection conductor. The connection conductor is inserted in the hole and is connected to the internal conductor. A lower surface of the connection conductor is located on a side closer to the upper surface of the base body other than the lower surface of the base body. The hole includes a reduced-diameter portion which has a diameter smaller than a diameter of the connection conductor between the lower surface of the connection conductor and the lower surface of the base body.
CERAMIC STRUCTURE AND WAFER SYSTEM
KAWANABE YASUNORI (Autor:in) / OKAWA YOSHIHIRO (Autor:in)
18.11.2021
Patent
Elektronische Ressource
Englisch
Ceramic wafer for improving conductivity of pure water and manufacturing device of ceramic wafer
| Europäisches Patentamt | 2022