Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
EDDY CURRENT DAMPER
An eddy current damper includes a magnet holding member, a first permanent magnet having a thickness (H1), a second permanent magnet having a thickness (H1), a conductive member, a ball nut, a screw shaft, and a copper layer having a thickness (H2). The second permanent magnet is adjacent to the first permanent magnets with a gap therebetween in the circumferential direction of the magnet holding member. The ball nut is fixed to the magnet holding member or the conductive member. The copper layer is fixed to the conductive member and is opposed to the first permanent magnet and the second permanent magnet with a gap therebetween. The thickness (H1) and the thickness (H2) satisfy, with respect to a distance (R1) between a central axis of the screw shaft and the center of gravity of the first permanent magnet:0.018≤H1/R1≤0.060, and0.0013≤H2/R1≤0.0065.
EDDY CURRENT DAMPER
An eddy current damper includes a magnet holding member, a first permanent magnet having a thickness (H1), a second permanent magnet having a thickness (H1), a conductive member, a ball nut, a screw shaft, and a copper layer having a thickness (H2). The second permanent magnet is adjacent to the first permanent magnets with a gap therebetween in the circumferential direction of the magnet holding member. The ball nut is fixed to the magnet holding member or the conductive member. The copper layer is fixed to the conductive member and is opposed to the first permanent magnet and the second permanent magnet with a gap therebetween. The thickness (H1) and the thickness (H2) satisfy, with respect to a distance (R1) between a central axis of the screw shaft and the center of gravity of the first permanent magnet:0.018≤H1/R1≤0.060, and0.0013≤H2/R1≤0.0065.
EDDY CURRENT DAMPER
NOGAMI HIROSHI (Autor:in) / IMANISHI KENJI (Autor:in) / NOGUCHI YASUTAKA (Autor:in) / MASUI RYOHSUKE (Autor:in) / SANO KUMPEI (Autor:in)
25.11.2021
Patent
Elektronische Ressource
Englisch