Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
METHOD OF PRODUCING A MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, AND CIRCUIT BOARD
A method of producing a multi-layer ceramic electronic component includes: forming a base film formed from an electrically conductive material on a surface of a ceramic body including internal electrodes laminated and drawn to the surface in such a manner that the base film is connected to the internal electrodes; forming a first nickel film on the base film by an electrolytic plating method; performing, after forming the first nickel film, heat treatment in a weakly reducing atmosphere at a temperature equal to or higher than a temperature at which the first nickel film is recrystallized; and forming a second nickel film on the first nickel film, on which the heat treatment is performed, by an electrolytic plating method.
METHOD OF PRODUCING A MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, AND CIRCUIT BOARD
A method of producing a multi-layer ceramic electronic component includes: forming a base film formed from an electrically conductive material on a surface of a ceramic body including internal electrodes laminated and drawn to the surface in such a manner that the base film is connected to the internal electrodes; forming a first nickel film on the base film by an electrolytic plating method; performing, after forming the first nickel film, heat treatment in a weakly reducing atmosphere at a temperature equal to or higher than a temperature at which the first nickel film is recrystallized; and forming a second nickel film on the first nickel film, on which the heat treatment is performed, by an electrolytic plating method.
METHOD OF PRODUCING A MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, AND CIRCUIT BOARD
SAKAI TOMOKI (Autor:in)
25.11.2021
Patent
Elektronische Ressource
Englisch
Europäisches Patentamt | 2023
|Europäisches Patentamt | 2021
|Europäisches Patentamt | 2023
|MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, AND CIRCUIT BOARD
Europäisches Patentamt | 2025
|Multi-layer ceramic electronic component, and circuit board
Europäisches Patentamt | 2024
|