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BONDING DEVICE AND BONDING METHOD
A bonding device includes an irradiator that irradiates a surface of a first component with ultraviolet rays, and a conveyor that conveys the first component, wherein the irradiator irradiates the first component held by the conveyor with the ultraviolet ray, and the conveyor conveys the first component irradiated with the ultraviolet rays to a surface of a second component, and brings the surface of the first component and the surface of the second component into contact with each other to bond the first component and the second component.
BONDING DEVICE AND BONDING METHOD
A bonding device includes an irradiator that irradiates a surface of a first component with ultraviolet rays, and a conveyor that conveys the first component, wherein the irradiator irradiates the first component held by the conveyor with the ultraviolet ray, and the conveyor conveys the first component irradiated with the ultraviolet rays to a surface of a second component, and brings the surface of the first component and the surface of the second component into contact with each other to bond the first component and the second component.
BONDING DEVICE AND BONDING METHOD
KUROKAWA MUNETAKA (Autor:in) / FUJIWARA NAOKI (Autor:in) / KIKUCHI TAKEHIKO (Autor:in) / KASAYA KAZUO (Autor:in) / MARUYAMA TAKESHI (Autor:in)
28.12.2023
Patent
Elektronische Ressource
Englisch
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