Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Fiber Board Providing Rigidity, Sound Reduction, and Thermal Insulation
A fiber board for a building structure is disclosed. The fiber board includes a fiber structure. The fiber structure includes a substrate fiber and a thermoplastic binder fiber. The substrate fiber is bound together by the thermoplastic binder fiber. The thermoplastic binder fiber makes up between 25 percent (%) and 35% by weight of the fiber board.
Fiber Board Providing Rigidity, Sound Reduction, and Thermal Insulation
A fiber board for a building structure is disclosed. The fiber board includes a fiber structure. The fiber structure includes a substrate fiber and a thermoplastic binder fiber. The substrate fiber is bound together by the thermoplastic binder fiber. The thermoplastic binder fiber makes up between 25 percent (%) and 35% by weight of the fiber board.
Fiber Board Providing Rigidity, Sound Reduction, and Thermal Insulation
COLLISON ALAN B (Autor:in) / BORGMAN REID (Autor:in) / POSPISIL DYLAN (Autor:in) / FUELBERTH CARL (Autor:in)
28.11.2024
Patent
Elektronische Ressource
Englisch
IPC:
E04B
Allgemeine Baukonstruktionen
,
GENERAL BUILDING CONSTRUCTIONS
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
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